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MT58L128V36F1T-6.8 PDF预览

MT58L128V36F1T-6.8

更新时间: 2023-08-15 00:00:00
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
26页 447K
描述
Cache SRAM, 128KX36, 6.8ns, CMOS, PQFP100, PLASTIC, MS-026, TQFP-100

MT58L128V36F1T-6.8 数据手册

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4Mb: 256K x 18, 128K x 32/36  
FLOW-THROUGH SYNCBURST SRAM  
TQFPPINDESCRIPTIONS(continued)  
x18  
x32/x36  
SYMBOL TYPE  
DESCRIPTION  
85  
85  
ADSC#  
Input Synchronous Address Status Controller: This active LOW input  
interrupts any ongoing burst, causing a new external address to be  
registered. A READ or WRITE is performed using the new address if  
CE# is LOW. ADSC# is also used to place the chip into power-down  
state when CE# is HIGH.  
31  
64  
31  
64  
MODE  
ZZ  
Input Mode: This input selects the burst sequence. A LOW on this pin  
selects “linear burst.” NC or HIGH on this pin selects “interleaved  
burst.” Do not alter input state while device is operating.  
Input Snooze Enable: This active HIGH, asynchronous input causes the  
device to enter a low-power standby mode in which all data in the  
memory array is retained. When ZZ is active, all other inputs are  
ignored.  
(a) 58, 59,  
62, 63, 68, 69, 56–59, 62, 63  
72, 73  
(b) 8, 9, 12,  
13, 18, 19, 72–75, 78, 79  
22, 23  
(a) 52, 53,  
DQa  
DQb  
Input/ SRAM Data I/Os: For the x18 version, Byte “a” is DQa pins; Byte  
Output “b” is DQb pins. For the x32 and x36 versions, Byte “a” is DQa  
pins; Byte “b” is DQb pins; Byte “c” is DQc pins; Byte “d” is  
DQd pins. Input data must meet setup and hold times around  
the rising edge of CLK.  
(b) 68, 69,  
(c) 2, 3, 6–9,  
12, 13  
(d) 18, 19,  
DQc  
DQd  
22–25, 28, 29  
74  
24  
51  
80  
1
NC/DQPa NC/ No Connect/Parity Data I/Os: On the x32 version, these pins are  
NC/DQPb  
NC/DQPc  
NC/DQPd  
I/O  
No Connect (NC). On the x18 version, Byte “a” parity is DQPa;  
Byte “b” parity is DQPb. On the x36 version, Byte “a” parity is  
DQPa; Byte “b” parity is DQPb; Byte “c” parity is DQPc; Byte  
“d” parity is DQPd.  
30  
15, 41, 65, 91 15, 41, 65, 91  
VDD  
Supply Power Supply: See DC Electrical Characteristics and Operating  
Conditions for range.  
4, 11, 20, 27, 4, 11, 20, 27,  
54, 61, 70, 77 54, 61, 70, 77  
V
DDQ  
Supply Isolated Output Buffer Supply: See DC Electrical Characteristics and  
Operating Conditions for range.  
5, 10, 14, 17, 5, 10, 14, 17,  
21, 26, 40, 55, 21, 26, 40, 55,  
VSS  
Supply Ground: GND.  
60, 67, 71,  
76, 90  
60, 67, 71,  
76, 90  
38, 39  
38, 39  
DNU  
NC  
Do Not Use: These signals may either be unconnected or wired to  
GND to improve package heat dissipation.  
1–3, 6, 7, 16,  
25, 28–30,  
51–53, 56,  
16, 66  
No Connect: These signals are not internally connected and  
may be connected to ground to improve package heat  
dissipation.  
57, 66, 75,  
78, 79, 95, 96  
42, 43  
42, 43  
NF  
No Function: These pins are internally connected to the die and  
will have the capacitance of input pins. It is allowable to leave  
these pins unconnected or driven by signals. Reserved for  
address expansion, pin 43 becomes an SA at 8Mb density and  
pin 42 becomes an SA at 16Mb density.  
4Mb: 256K x 18, 128K x 32/36 Flow-Through SyncBurst SRAM  
MT58L256L18F1_F.p65 – Rev. F, Pub. 1/03 EN  
MicronTechnology,Inc.,reservestherighttochangeproductsorspecificationswithoutnotice.  
6
©2003,MicronTechnology,Inc.  

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