MT1118
◆
ABSOLUTE MAXTMUM RETINGS
SYMBOL
PARAMETER
MAXIMUM
UNITS
VIN
Input supply voltage
6
V
Thermal resistance junction to ambient
SOT-89
θJA
71
230
OC/W
SOT-23 & SOT-23-5
TJ
TSTG
TLEAD
Operating junction temperature range
Storage temperature range
Lead temperature (soldering) 10sec
150
OC
OC
OC
- 65 to 150
260
Note 1: Exceeding these ratings could cause damage to the device. All voltages are with respect to Ground. Currents
are positive into, negative out of the specified terminal.
◆
ORDERING INFORMATION
(max)A
DEVICE
MT1118X-X.XJ
MT1118X-XXY
PACKAGE
VOUT VOLTS
TA (OC
)
J
SOT-89
SOT-23
X.X_ 1.5/ 1.8/ 2.5/ 2.8/ 3.0/ 3.3
X_1/ 2, Y_A/ B/ C/ D/ E/ F
500mA
300mA
-40 ~ 85
-40 ~ 85
S
◆
POWER DISSIPATION TABLE:
θJA
Df( mW/OC)
TA≤ 25OC
Power rating(mW)
TA=70OC
Power rating(mW)
TA= 85OC
Power rating (mW)
Package
(OC /W )
TA≥ 25OC
J
S
71
14.1
3.5
1763
397
1128
239
239
916
187
187
230
230
N
3.5
397
Note :
1. Exceeding the maximum allowable power disspation will result in excessive die temperature, and the regulator will go into
thermal shutdown.
2.TJ: Junction Temperature Calculation:
TJ = TA+ (PD × θJA)
The θJA numbers are guidelines for the thermal performance of the device/PC-board system. All of the above assume no
ambient airflow.
3.θJA: Thermal Resistance-Junction to Ambient, DF : Derating factor, Po: Power consumption.
4.θJT: Thermal Resistance-Junction to Ambient, TC: case(Tab) temperature,
TJ = TC + (PD × θJT)
for S package.
◆
RECOMMENDED OPERATING CONDITIONS:
Parameter
Recommended Operating
Symbol
Units
Min.
2.8
5
Typ.
Max.
VIN
5.5
V
Input Voltage
IO
TJ
mA
Load Current (with adequate heatsinking)
Junction temperature
125
OC
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