SPECIFICATION FOR APPROVAL
REF :
PROD.
NAME
PAGE: 1
ABC'S DWG NO.
ABC'S ITEM NO.
MS3261□□□□L□-□□□
MULTILAYER CHIP INDUCTOR
Ⅰ﹒CONFIGURATION & DIMENSIONS:
A
D
D
G
I
I
B
( PCB Pattern )
Unit : m/m
Series
A
B
C
D
G
H
I
MS3261
3.20±0.20
1.60±0.20
1.10±0.20
0.60±0.40
2.2
1.4
1.1
Ⅱ﹒SCHEMATIC DIAGRAM:
a
b
c
Ⅲ﹒MATERIALS:
a﹒Body:Ferrite
b﹒Internal conductor:Silver or Ag / Pd
c﹒Terminal:Cu/Sn
d﹒Remark:Products comply with RoHS' requirements
Ⅳ﹒GENERAL SPECIFICATION:
a﹒Storage temp.:-40℃---- +105℃
Peak Temp:260℃ max.
b﹒Operating temp.:-55℃ ---- +125℃
c﹒Terminal storength:
Max time above 230℃ :50sec max.
Max time above 200℃ :70sec max.
Temperature
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
+2.0 ~ 4.0℃
/ sec max.
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120sec
-(1.0 ~ 5.0)℃ / sec max.
F
Peak Temperature:
260℃
250
200
150
100
50
230℃
Type
F ( kgf )
1.0
time ( sec )
50sec max.
MS3261
30±5
d﹒Solderability:
70sec max.
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
0
50
100
150
200
250
Dip time : 4±1 seconds
Time ( seconds )
AR-001A