Datasheet > MPX4100AP

MPX4100AP

更新时间： 2024-01-18 18:36:29

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
13页	151K
描述
UNIBODY COMPENSATED

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数据手册

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MPX4100AP 数据手册

Pressure

Maximum Ratings

Table 2. MAXIMUM RATINGS⁽¹⁾

Rating

Maximum Pressure (P1 > P2)

Storage Temperature

Symbol

P_MAX

T_stg

Value

400

Unit

kPa

°C

-40 to +125

Operating Temperature

T_A

°C

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

3 (Unibody)

2 (Small Outline Package)

V_S

Thin Film

Temperature

Compensation

and

Gain Stage #2

and

1 (Unibody)

4 (Small Outline Package)

Sensing

Element

V_OUT

Ground

Reference

Shift Circuitry

Gain Stage #1

Pins 4, 5, and 6 are NO CONNECTS

for unibody package devices.

2 (Unibody)

3 (Small Outline Package)

GND

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

for small outline package devices.

Figure 1. Fully Integrated Pressure Sensor Schematic

for Unibody Package and Small Outline Package

MPX4100A

Sensors

Freescale Semiconductor

1 2 345 6 7...13

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