MPM3814C – 6V, 1A, ULTRA-SMALL STEP-DOWN POWER MODULE
PIN FUNCTIONS
Pin #
Name Description
SW SW test pin. Float the SW pin.
PGND Power ground.
1
2, 7, 8
3
EN
On/off control.
Analog ground for the internal control circuit. The AGND pin is not connected to PGND
internally. Connect AGND to the PGND on the PCB layout.
4
5
AGND
Feedback. Use an external resistor divider from the output to AGND, tapped to the FB pin,
to set the output voltage (VOUT).
FB
6
OUT_S Output voltage sense.
OUT Power output.
9, 10
Power good indicator. The output of the PG pin is an open drain with an internal pull-up
11
PG
IN
resistor connected to the IN pin. PG is pulled up to IN when the FB voltage is within 10% of
the regulation level; otherwise, PG is low.
12, 13,
14
Power input.
Thermal Resistance (3) (4) (5) (6) (7)
ECLGA-14 (2.5mmx2.5mm)
θJA ...................................................... 56.7°C/W
θJC_TOP ................................................ 6.85°C/W
θJB ...................................................... 25.5°C/W
(1)
ABSOLUTE MAXIMUM RATINGS
VSW......................................................................
-0.3V (-5V for <10ns) to +6.5V (10V for <10ns)
All other pins................................-0.3V to +6.5V
Continuous power dissipation (TA = 25°C)(5)
ECLGA-14 (2.5mmx2.5mm) ...................... 2.2W
Junction temperature................................150°C
Lead temperature .....................................260°C
Storage temperature................ -65°C to +150°C
Notes:
1) Exceeding these ratings may damage the device.
2) The device is not guaranteed to function outside of its
operating conditions.
3) θJA is the junction-to-ambient thermal resistance, θJC_TOP is the
junction-to-case top thermal characterization parameter, and
θJB is the junction-to-board thermal characterization
parameter.
4) The thermal parameter is based on the test on the MPS
evaluation board (T-EVM3814C-PA-00A) under a no airflow
cooling condition in a standard enclosure. The board size is
5.1cmx5.1cm, 2-layer, of which top and bottom layer Cu
thickness is 2oz.
5) The maximum allowable power dissipation is a function of the
maximum junction temperature, TJ (MAX), the junction-to-
ambient thermal resistance, θJA, and the ambient
temperature, TA. The maximum allowable continuous power
dissipation at any ambient temperature is calculated by PD
(MAX) = (TJ (MAX) - TA) / θJA. Exceeding the maximum
allowable power dissipation produces an excessive die
temperature.
ESD Ratings
Human body model (HBM) ...................... 2000V
Charged device model (CDM) ................. 2000V
Recommended Operating Conditions (2)
Operation input voltage range .........2.75V to 6V
Operating junction temp (TJ).... -40°C to +125°C
6) The junction-to-case top thermal characterization parameter,
θJC_TOP, estimates the junction temperature in the real system,
based on equation TI = θJC_TOP x PLOSS + TCASE_TOP. Where
PLOSS is the entire loss of the module in real applications, and
TCASE_TOP is case top temperature
7) The junction-to-board thermal characterization parameter, θJB,
estimation the junction temperature in the real system, based
on equation TI = θJB x PLOSS +TBOARD. Where PLOSS is the entire
power loss of the module in real applications, and TBOARD is
board temperature.
MPM3814C Rev. 1.0
4/15/2022
MonolithicPower.com
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2022 MPS. All Rights Reserved.
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