是否无铅: | 含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | 33 X 33 MM, LEAD FREE, PLASTIC, FCBGA-1023 | 针数: | 1023 |
Reach Compliance Code: | not_compliant | ECCN代码: | 5A992 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.52 |
地址总线宽度: | 32 | 位大小: | 32 |
边界扫描: | YES | 最大时钟频率: | 133 MHz |
外部数据总线宽度: | 32 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B1023 |
JESD-609代码: | e2 | 长度: | 33 mm |
低功率模式: | YES | 湿度敏感等级: | 3 |
端子数量: | 1023 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HBGA | 封装形状: | SQUARE |
封装形式: | GRID ARRAY, HEAT SINK/SLUG | 峰值回流温度(摄氏度): | 245 |
认证状态: | Not Qualified | 座面最大高度: | 3.38 mm |
速度: | 1500 MHz | 最大供电电压: | 1.155 V |
最小供电电压: | 1.045 V | 标称供电电压: | 1.1 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | Tin/Silver (Sn/Ag) | 端子形式: | BALL |
端子节距: | 1 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 33 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC8572VTAVNE | NXP |
获取价格 |
PowerQUICC 32-Bit Power Arch SoC, 2 X 1.5GHz, DDR2/3, PCIe, GbE, SRIO, 0 to 105C, R2.2.1 |
![]() |
MPC857DSL | FREESCALE |
获取价格 |
PowerQUICC⑩ Family Hardware Specifications |
![]() |
MPC857DSL | MOTOROLA |
获取价格 |
Hardware Specifications |
![]() |
MPC857DSLCVR66B | NXP |
获取价格 |
RISC PROCESSOR |
![]() |
MPC857DSLVR50B | NXP |
获取价格 |
RISC PROCESSOR |
![]() |
MPC857DSLZP50B | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,BGA,357PIN,PLASTIC |
![]() |
MPC857DSLZQ50B | NXP |
获取价格 |
RISC PROCESSOR |
![]() |
MPC857T | MOTOROLA |
获取价格 |
Hardware Specifications |
![]() |
MPC857TCZP66B | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,BGA,357PIN,PLASTIC |
![]() |
MPC857TVR100B | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture, 100MHz, Communications Processor, 0 to 105C |
![]() |