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MPC8533EHXAAFB

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飞思卡尔 - FREESCALE /
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116页 1273K
描述
PowerQUICC™ III Integrated Processor Hardware Specifications

MPC8533EHXAAFB 数据手册

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Document Number: MPC8533EEC  
Rev. 3, 11/2009  
Freescale Semiconductor  
Technical Data  
MPC8533E PowerQUICC™ III  
Integrated Processor  
Hardware Specifications  
Contents  
1 MPC8533E Overview  
This section provides a high-level overview of MPC8533E  
features. Figure 1 shows the major functional units within  
the device.  
1. MPC8533E Overview . . . . . . . . . . . . . . . . . . . . . . . . . 1  
2. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . 8  
3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13  
4. Input Clocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14  
5. RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . 16  
6. DDR and DDR2 SDRAM . . . . . . . . . . . . . . . . . . . . . 17  
7. DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
8. Enhanced Three-Speed Ethernet (eTSEC),  
1.1  
Key Features  
MII Management . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
9. Ethernet Management Interface Electrical  
The following list provides an overview of the device feature  
set:  
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38  
10. Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40  
11. Programmable Interrupt Controller . . . . . . . . . . . . . 51  
12. JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52  
13. I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54  
14. GPIO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57  
15. PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58  
16. High-Speed Serial Interfaces (HSSI) . . . . . . . . . . . . 60  
17. PCI Express . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70  
18. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 78  
19. Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90  
20. Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93  
21. System Design Information . . . . . . . . . . . . . . . . . . 102  
22. Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . 111  
23. Document Revision History . . . . . . . . . . . . . . . . . . 114  
High-performance 32-bit Book E–enhanced core  
built on Power Architecture™ technology:  
— 32-Kbyte L1 instruction cache and 32-Kbyte L1  
data cache with parity protection. Caches can be  
locked entirely or on a per-line basis, with  
separate locking for instructions and data.  
— Signal-processing engine (SPE) APU (auxiliary  
processing unit). Provides an extensive  
instruction set for vector (64-bit) integer and  
fractional operations. These instructions use both  
the upper and lower words of the 64-bit GPRs as  
they are defined by the SPE APU.  
© Freescale Semiconductor, Inc., 2008, 2009. All rights reserved.  

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