是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516 |
针数: | 516 | Reach Compliance Code: | not_compliant |
ECCN代码: | 5A002 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.31 | Is Samacsys: | N |
其他特性: | ALSO REQUIRES 3.3V I/O SUPPLY | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 66.67 MHz | 外部数据总线宽度: | 32 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B516 | JESD-609代码: | e0 |
长度: | 27 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 516 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HBGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, HEAT SINK/SLUG |
峰值回流温度(摄氏度): | 225 | 认证状态: | Not Qualified |
座面最大高度: | 2.55 mm | 速度: | 333 MHz |
最大供电电压: | 1.5 V | 最小供电电压: | 0.95 V |
标称供电电压: | 1 V | 表面贴装: | YES |
技术: | CMOS | 端子面层: | Tin/Lead/Silver (Sn/Pb/Ag) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 27 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC8313EZQAFFA | FREESCALE |
获取价格 |
PowerQUICC™ II Pro Processor Hardware Specifi | |
MPC8313EZQAFFA | NXP |
获取价格 |
32-BIT, 333MHz, MICROPROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII- | |
MPC8313EZQAFFB | FREESCALE |
获取价格 |
PowerQUICC™ II Pro Processor Hardware Specifi | |
MPC8313EZQAFFB | NXP |
获取价格 |
32-BIT, 333 MHz, MICROPROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII | |
MPC8313EZQAFFC | NXP |
获取价格 |
IC,MICROPROCESSOR,32-BIT,CMOS,BGA,516PIN,PLASTIC | |
MPC8313EZQAGDA | NXP |
获取价格 |
32-BIT, 400MHz, MICROPROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII- | |
MPC8313EZQAGDC | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 400MHz, DDR1/2, PCI, GbE, USB, SEC, 0 to 105C, | |
MPC8313EZQAGFA | NXP |
获取价格 |
MPC8313EZQAGFA | |
MPC8313EZQGDD | FREESCALE |
获取价格 |
PowerQUICC™ II Pro Processor Hardware Specifi | |
MPC8313EZQGDDA | FREESCALE |
获取价格 |
PowerQUICC™ II Pro Processor Hardware Specifi |