是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | BGA | 包装说明: | 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII-516 |
针数: | 516 | Reach Compliance Code: | compliant |
ECCN代码: | 3A001.A.3 | HTS代码: | 8542.31.00.01 |
风险等级: | 5.31 | Is Samacsys: | N |
其他特性: | ALSO REQUIRES 3.3V I/O SUPPLY | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 66.67 MHz | 外部数据总线宽度: | 32 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B516 | JESD-609代码: | e0 |
长度: | 27 mm | 低功率模式: | YES |
端子数量: | 516 | 最高工作温度: | 105 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HBGA | 封装等效代码: | BGA516,26X26,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, HEAT SINK/SLUG |
电源: | 1,1.8/2.5,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.55 mm | 速度: | 333 MHz |
子类别: | Microprocessors | 最大供电电压: | 1.5 V |
最小供电电压: | 0.95 V | 标称供电电压: | 1 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | TIN LEAD |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 27 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MPC8313CZQAFFB | NXP |
获取价格 |
32-BIT, 333MHz, MICROPROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII- |
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MPC8313CZQAFFB | FREESCALE |
获取价格 |
PowerQUICC™ II Pro Processor Hardware Specifi |
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MPC8313CZQAFFC | NXP |
获取价格 |
PowerQUICC, 32 Bit Power Architecture SoC, 333MHz, DDR1/2, PCI, GbE, USB, -40 to 105C, Rev |
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MPC8313CZQAGD | NXP |
获取价格 |
32-BIT, 400MHz, MICROPROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII- |
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MPC8313CZQAGDA | NXP |
获取价格 |
32-BIT, 400MHz, MICROPROCESSOR, PBGA516, 27 X 27 MM, 2.25 MM HEIGHT, 1 MM PITCH, TEPBGAII- |
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MPC8313CZQAGDB | NXP |
获取价格 |
暂无描述 |
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MPC8313CZQAGDC | NXP |
获取价格 |
RISC PROCESSOR |
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MPC8313CZQGDD | FREESCALE |
获取价格 |
PowerQUICC™ II Pro Processor Hardware Specifi |
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MPC8313CZQGDDA | FREESCALE |
获取价格 |
PowerQUICC™ II Pro Processor Hardware Specifi |
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MPC8313CZQGDDB | FREESCALE |
获取价格 |
PowerQUICC™ II Pro Processor Hardware Specifi |
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