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MPC8265AZUPJD PDF预览

MPC8265AZUPJD

更新时间: 2023-01-02 17:30:25
品牌 Logo 应用领域
恩智浦 - NXP 外围集成电路
页数 文件大小 规格书
48页 712K
描述
RISC Microprocessor, 32-Bit, 300MHz, CMOS, PBGA480,

MPC8265AZUPJD 技术参数

生命周期:Transferred包装说明:BGA, BGA480,29X29,50
Reach Compliance Code:unknown风险等级:5.8
位大小:32JESD-30 代码:S-PBGA-B480
端子数量:480最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA480,29X29,50
封装形状:SQUARE封装形式:GRID ARRAY
电源:2,3.3 V认证状态:Not Qualified
速度:300 MHz子类别:Microprocessors
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
uPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC

MPC8265AZUPJD 数据手册

 浏览型号MPC8265AZUPJD的Datasheet PDF文件第2页浏览型号MPC8265AZUPJD的Datasheet PDF文件第3页浏览型号MPC8265AZUPJD的Datasheet PDF文件第4页浏览型号MPC8265AZUPJD的Datasheet PDF文件第5页浏览型号MPC8265AZUPJD的Datasheet PDF文件第6页浏览型号MPC8265AZUPJD的Datasheet PDF文件第7页 
Technical Data  
MPC8260AEC/D  
Rev.0.9 8/2003  
MPC826xA (HiP4) Family  
Hardware Specications  
This document contains detailed information on power considerations, DC/AC electrical  
characteristics, and AC timing specifications for .25µm (HiP4) devices in the  
PowerQUICC II™ MPC8260 communications processor family. These devices include the  
MPC8260, the MPC8255, the MPC8264, the MPC8265, and the MPC8266. Throughout this  
document, these devices are collectively referred to as the MPC826xA.  
The following topics are addressed:  
Topic  
Page  
2
Section 1.1, “Features”  
Section 1.2, “Electrical and Thermal Characteristics”  
Section 1.2.1, “DC Electrical Characteristics”  
Section 1.2.2, “Thermal Characteristics”  
Section 1.2.3, “Power Considerations”  
Section 1.2.4, “AC Electrical Characteristics”  
Section 1.3, “Clock Configuration Modes”  
Section 1.3.1, “Local Bus Mode”  
Section 1.3.2, “PCI Mode”  
6
7
11  
11  
12  
20  
20  
23  
29  
43  
45  
Section 1.4, “Pinout”  
Section 1.5, “Package Description”  
Section 1.6, “Ordering Information”  
NOTE: Document Revision History  
Changes to this document are summarized in Table 22 on  
page 45.  

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