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MPC8266AZUPJDC PDF预览

MPC8266AZUPJDC

更新时间: 2024-01-03 13:01:03
品牌 Logo 应用领域
恩智浦 - NXP 外围集成电路
页数 文件大小 规格书
50页 996K
描述
RISC PROCESSOR

MPC8266AZUPJDC 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:LBGA,Reach Compliance Code:unknown
ECCN代码:3A991HTS代码:8542.31.00.01
风险等级:5.81地址总线宽度:32
位大小:32边界扫描:YES
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-PBGA-B480
JESD-609代码:e0长度:37.5 mm
低功率模式:NO湿度敏感等级:3
端子数量:480封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE峰值回流温度(摄氏度):220
座面最大高度:1.65 mm表面贴装:YES
技术:CMOS端子面层:TIN LEAD
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:30
宽度:37.5 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR, RISC
Base Number Matches:1

MPC8266AZUPJDC 数据手册

 浏览型号MPC8266AZUPJDC的Datasheet PDF文件第2页浏览型号MPC8266AZUPJDC的Datasheet PDF文件第3页浏览型号MPC8266AZUPJDC的Datasheet PDF文件第4页浏览型号MPC8266AZUPJDC的Datasheet PDF文件第5页浏览型号MPC8266AZUPJDC的Datasheet PDF文件第6页浏览型号MPC8266AZUPJDC的Datasheet PDF文件第7页 
Document Number: MPC8260AEC  
Rev. 2.0, 06/2009  
Freescale Semiconductor  
Technical Data  
MPC8260A  
PowerQUICC™ II Integrated  
Communications Processor  
Hardware Specifications  
Contents  
1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
2. Electrical and Thermal Characteristics . . . . . . . . . . . . 7  
3. Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 23  
4. Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33  
5. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 46  
6. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 48  
7. Document Revision History . . . . . . . . . . . . . . . . . . . 48  
This document contains detailed information on power  
considerations, DC/AC electrical characteristics, and AC  
timing specifications for .25μm (HiP4) devices in the  
PowerQUICC II™ MPC8260 communications processor  
family. These devices include the MPC8260, the MPC8255,  
the MPC8264, the MPC8265, and the MPC8266.  
Throughout this document, these devices are collectively  
referred to as the MPC826xA.  
© Freescale Semiconductor, Inc., 2005–2009. All rights reserved.  

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