MP8774H – 18V, 12A, SYNCHRONOUS, STEP-DOWN CONVERTER
PIN FUNCTIONS
Pin #
Name Description
1, 15
NC
No connection. NC must be left floating.
Bootstrap. Connect a capacitor between SW and BST to form a floating supply across the
high-side switch driver. A BST resistor less than 4.7Ω is recommended.
2
3
4
5
6
7
BST
Enable. Pull EN high to enable the MP8774H. When floating, EN is pulled down to GND
and disabled by an internal 3.3MΩ resistor.
EN
FB
Feedback. FB sets the output voltage when connected to the tap of an external resistor
divider between output and GND.
Signal ground. AGND is not connected to the system ground internally. Ensure that AGND
is connected to the system ground in the PCB layout.
AGND
SS
Soft start. Connect a capacitor across SS and GND to set the soft-start time and avoid
inrush current at start-up.
Power good output. The output of PG is an open drain. PG changes state if UVP, OCP,
OTP, or OV occurs.
PG
Supply voltage. The MP8774H operates from a 3V to 18V input rail. A capacitor (C1) is
needed to decouple the input rail. Use a wide PCB trace to make the connection.
8
VIN
9, 10,
System ground. PGND is the reference ground of the regulated output voltage. PGND
11, 12, PGND requires careful consideration during the PCB layout. PGND is recommended to be
13
14
16
connected to GND with coppers and vias.
Internal bias supply output. Decouple VCC with a 1µF capacitor. Place the VCC capacitor
close to VCC and GND.
VCC
SW
Switch output. Connect SW with a wide PCB trace.
(1)
Thermal Resistance
θJA θJC
ABSOLUTE MAXIMUM RATINGS
QFN-16 (3mmx3mm)
VIN .................................................-0.3V to +20V
VSW........................................ -0.3V (-5V < 10ns)
to VIN + 0.7V (23V < 10ns)
EV8774H-Q-00A (4)................ 38......10 .... °C/W
JESD51-7 (5) .......................... 50......12 .... °C/W
VBST ...................................................... VSW + 4V
VEN .................................................................VIN
All other pins.................................. -0.3V to +4V
Continuous power dissipation (TA = 25°C) (2) (4)
................................................................... 3.2W
Junction temperature ................................150°C
Lead temperature .....................................260°C
Storage temperature............... -65°C to +125°C
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX) - TA) / θJA. Exceeding the maximum allowable power
dissipation produces an excessive die temperature, causing
the regulator to go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on EV8774H-Q-00A, 4-layer PCB.
5) The value of θJA given in this table is only valid for
comparison with other packages and cannot be used for
design purposes. These values were calculated in
accordance with JESD51-7, and simulated on a specified
JEDEC board. They do not represent the performance
obtained in an actual application.
Recommended Operating Conditions (3)
Supply voltage (VIN) ............................3V to 18V
Output voltage (VOUT)............. 0.6V to VIN * DMAX
or 12V max
Operating junction temp (TJ).... -40°C to +125°C
MP8774H Rev. 1.0
5/22/2019
www.MonolithicPower.com
MPS Proprietary Information. Patent Protected. Unauthorized Photocopy and Duplication Prohibited.
© 2019 MPS. All Rights Reserved.
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