MP2492–2A,55V, 100kHzWITH PROGRAMMABLE OUTPUT CURRENT LIMIT
ORDERING INFORMATION
Part Number
MP2492DN*
MP2492DQ**
Package
SOIC8E
Top Marking
MP2492DN
3Q
Free Air Temperature (TA)
–40°C to +85°C
QFN10(3mmx3mm)
–40°C to +85°C
* For Tape & Reel, add suffix –Z (e.g. MP2492DN–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP2492DN–LF–Z)
** For Tape & Reel, add suffix –Z (e.g. MP2492DQ–Z).
For RoHS compliant packaging, add suffix –LF (e.g. MP2492DQ–LF–Z)
PACKAGE REFERENCE
SW
VIN
GND
EN
SW
BST
ISP
ISN
VIN
BST
GND
PGOOD
ISP
FB
SS
FB
ISN
SS
EXPOSED PAD
EXPOSED PAD
ON BACKSIDE
ON BACKSIDE
CONNECT TO GND
CONNECT TO GND
SOIC8E
QFN10(3mmx3mm)
Recommended Operating Conditions (3)
Input Voltage VIN ..............................4.5V to 55V
Output Voltage VOUT (VIN>16.5V)......0.8V to 15V
Output Voltage VOUT (VIN<=16.5V) .....................
........................................0.8V to (VIN–1.7) V
Operating Junct. Temp. .......... –40°C to +125°C
ABSOLUTE MAXIMUM RATINGS (1)
Input Voltage VIN .......................................... 60V
VSW....................................... –0.3V to VIN + 0.3V
VBST ................................................... VSW + 6.5V
VISN, vISP................................................0V to15V
| VISN, - vISP | ........................................ 0 to 0.5V
EN,.......................................................0V to15V
Thermal Resistance (4)
θJA
θJC
V
All Other Pins..............................–0.3V to +6.5V
SOIC8E................................... 50...... 10 .. °C/W
QFN10 (3 x 3 mm)...................50........12... °C/W
(2)
Continuous Power Dissipation (TA = +25°C)
SOIC8E...................................................... 2.5W
QFN10 (3 x 3 mm) ..................................... 2.5W
Junction Temperature...............................150°C
Lead Temperature ....................................260°C
Storage Temperature.............. –50°C to +150°C
Notes:
1) Exceeding these ratings may damage the device.
2) The maximum allowable power dissipation is a function of the
maximum junction temperature TJ (MAX), the junction-to-
ambient thermal resistance θJA, and the ambient temperature
TA. The maximum allowable continuous power dissipation at
any ambient temperature is calculated by PD (MAX) = (TJ
(MAX)-TA)/θJA. Exceeding the maximum allowable power
dissipation will cause excessive die temperature, and the
regulator will go into thermal shutdown. Internal thermal
shutdown circuitry protects the device from permanent
damage.
3) The device is not guaranteed to function outside of its
operating conditions.
4) Measured on JESD51-7, 4-layer PCB.
MP2492 Rev. 1.0
12/20/2010
www.MonolithicPower.com
MPS Proprietary Information. Unauthorized Photocopy and Duplication Prohibited.
© 2010 MPS. All Rights Reserved.
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