Datasheet > MMBZ5221B_10

MMBZ5221B_10

更新时间： 2024-09-25 10:52:19

品牌	Logo	应用领域
美台 - DIODES		稳压二极管
页数	文件大小	规格书
5页	81K
描述
350mW SURFACE MOUNT ZENER DIODE

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中文翻译

获取价格

数据手册

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MMBZ5221B_10 数据手册

MMBZ5221B - MMBZ5259B

350mW SURFACE MOUNT ZENER DIODE

Features

Mechanical Data

•

Planar Die Construction

350mW Power Dissipation on FR-4 PCB

General Purpose, Medium Current

Ideally Suited for Automated Assembly Processes

Lead, Halogen and Antimony Free, RoHS Compliant "Green"

Device (Notes 2 and 3)

•

Case: SOT-23

Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

Moisture Sensitivity: Level 1 per J-STD-020

Terminal Connections: See Diagram

Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

•

Qualified to AEC-Q101 Standards for High Reliability

•

Marking Information: See Page 4

Ordering Information: See Page 4

Weight: 0.008 grams (approximate)

Top View

Device Schematic

Maximum Ratings @T_A= 25°C unless otherwise specified

Characteristic

Symbol

Value

Unit

0.9

Forward Voltage

@ I_F= 10mA

V_F

Thermal Characteristics

Characteristic

Power Dissipation (Note 1)

Symbol

Value

350

Unit

P_D

Thermal Resistance, Junction to Ambient Air (Note 1)

Operating and Storage Temperature Range

357

°C/W

°C

R_θ

-65 to +150

_J,T_STG

Notes:

1. Mounted on FR4 PC Board with recommended pad layout which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf

2. No purposefully added lead. Halogen and Antimony Free.

3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date Code

V9 are built with Non-Green Molding Compound and may contain Halogens or Sb₂O₃Fire Retardants.

1 of 5

www.diodes.com

August 2010

MMBZ5221B - MMBZ5259B

Document number: DS18011 Rev. 21 - 2

12 3 4 5

中文翻译

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