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MM3ZXXXT1 PDF预览

MM3ZXXXT1

更新时间： 2024-09-27 03:13:23
品牌 Logo 应用领域
安森美 - ONSEMI 稳压器
页数 文件大小 规格书
5页 59K
描述
Zener Voltage Regulators 200 mW SOD−323 Surface Mount

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MM3Z2V4T1 SERIES  
Zener Voltage Regulators  
200 mW SOD−323 Surface Mount  
This series of Zener diodes is packaged in a SOD−323 surface  
mount package that has a power dissipation of 200 mW. They are  
designed to provide voltage regulation protection and are especially  
attractive in situations where space is at a premium. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
1
2
Specification Features:  
Cathode  
Anode  
• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V  
• Steady State Power Rating of 200 mW  
• Small Body Outline Dimensions:  
0.067” x 0.049” (1.7 mm x 1.25 mm)  
• Low Body Height: 0.035” (0.9 mm)  
2
1
• Package Weight: 4.507 mg/Unit  
• ESD Rating of Class 3 (>16 kV) per Human Body Model  
• Pb−Free Packages are Available  
SOD−323  
CASE 477  
STYLE 1  
Mechanical Characteristics:  
CASE: Void-free, Transfer-Molded Plastic  
FINISH: All External Surfaces are Corrosion Resistant  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
MARKING DIAGRAM  
LEADS: Plated with Pb−Sn or Sn Only (Pb−Free)  
POLARITY: Cathode Indicated by Polarity Band  
FLAMMABILITY RATING: UL 94 V−0  
xx  
G
G
MOUNTING POSITION: Any  
xx = Specific Device Code  
M = Date Code*  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
Total Device Dissipation FR−5 Board,  
P
D
*Date Code orientation may vary depending  
upon manufacturing location.  
(Note 1) @ T = 25°C  
200  
1.5  
mW  
mW/°C  
A
Derate above 25°C  
Thermal Resistance, Junction−to−Ambient  
R
635  
°C/W  
°C  
q
JA  
ORDERING INFORMATION  
Junction and Storage Temperature Range T , T  
−65 to +150  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−4 Minimum Pad  
Device  
Package  
Shipping†  
MM3ZxxxT1  
MM3ZxxxT1G  
SOD−323  
3000/Tape & Reel  
3000/Tape & Reel  
SOD−323  
(Pb−Free)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
November, 2006 − Rev. 7  
MM3Z2V4T1/D  
 
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