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ꢀꢁꢂꢃꢄꢅꢂꢃꢃꢄꢆꢇꢇꢈꢉꢊꢄꢋꢂꢊꢉꢌꢄ
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5.33
5.43
VA Package Dimensions
5.08
5.24
VA Hall Plate / Chip Location
3.615
2.69
45o
1.765
Hall Plates
0.25 0.25
2.700
1.22
1.32
x
3.76
3.86
0.387
0.289
1.700
4.50
4.10
A
B
C
45o
Bevel
X 1mm
2.180
5o
5o
(2x)
(2x)
*
9836
24A88
Marked
Surface
3.46 3.79
3.30 3.63
0.387
0.289
D
0.40
0.60
All Dimensions in millimeters
0.35
0.25
E
0.22
REF
0.10
0.00
1.0
MAX
1
2
3
4
1.20
1.10
A
B
C
D
E
15.50
14.50
0.66
0.61
18.5
17.5
0.29
0.24
45o
0.45
0.35
0.31
0.18
*
MARKING:
Line 1:
1st and 2nd digits (98)
3rd and 4th digits (36)
=
=
Year (1998)
Week of Year
Tape Line
Line 2:
1st and 2nd digits (15)
3rd digit (A)
4th and 5th digits(88)
= Chip I.D. (90224)
=
=
Chip Revision
Lot Number
PINOUT:
Pin 1
VDD
Output
GND
VA Tape Dimensions
Pin
Pin
Pin
2
3
4
1
2
Output
NOTES:
1.) Controlling dimension: mm
2.) Leads must be free of flash and
plating voids
3.) Leads must not arc toward
the rear of package
4.) Lead frame material:
EFTEC 64T
5.) Molding compound:
Sumitomo EME 6300H
6.) Package dimensions exclude
molding flash
0.40
0.25
7.) Tolerance is 0.254mm unless
otherwise specified
6.39
6.31
4.30
3.70
0.60
0.40
13.00
12.40
For more information, please contact:
Melexis, Inc.
41 Locke Road
Concord, NH 03301
Phone: (603) 223-2362
Fax: (603) 223-9614
E-mail: sales@melexis.com
Web: www.melexis.com
MLX90224 Dual Hall Effect Latch
Rev 1.2
8/May/99
Page 8