Datasheet > MLPF-WB55-01E3

MLPF-WB55-01E3

更新时间： 2025-09-13 14:57:39

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
13页	569K
描述
与STM32WB55相匹配的2.4 GHz低通滤波器

阅读下载

中文翻译

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

MLPF-WB55-01E3 数据手册

MLPF-WB55-01E3

Package information

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,

depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product

status are available at: www.st.com. ECOPACK is an ST trademark.

2.1

Bumpless CSP package information

Figure 9. Bumpless CSP package outline

BOTTOM VIEW (pads up)

GND3

GND2

GND1

OUT

SIDE VIEW

GND4

Coating 25µm

Table 4. Bumpless CSP package mechanical data

Parameter

Description

Min.

975

Typ.

1000

1600

500

Max.

1025

1625

Unit

µm

X dimension of the die

Y dimension of the die

X pitch

1575

Y pitch

587

Distance from bump to edge of die on X axis

Distance from pad to edge of die on Y axis

Pad dimension

250

213

200

Substrate thickness

375

400

425

DS12804 - Rev 3

page 5/13

1 2 3 456 7 8...13

中文翻译

下载PDF

与MLPF-WB55-01E3相关器件

型号	品牌	获取价格	描述	数据表
MLPF-WB55-02E3	STMICROELECTRONICS	获取价格	2.4 GHz Matched filter companion chip for STM32WB55Vx
MLPM-6PIN	INFINEON	获取价格	Package Dimensions
MLPMR2	KINGSTON	获取价格	CANVAS REACT PLUS microSD Creativity and Inspiration in Professional Quality
MLPMR2/128GB	KINGSTON	获取价格	CANVAS REACT PLUS microSD Creativity and Inspiration in Professional Quality
MLPMR2/256GB	KINGSTON	获取价格	CANVAS REACT PLUS microSD Creativity and Inspiration in Professional Quality
MLPMR2/64GB	KINGSTON	获取价格	CANVAS REACT PLUS microSD Creativity and Inspiration in Professional Quality
MLPNC-7100	TE	获取价格	Ultra-Low Phase Noise
MLPNC-7100-SMA850	TE	获取价格	Ultra-Low Phase Noise
MLPNC-7100-SMA850	MACOM	获取价格	NLTL Comb Generator
MLPNC-7100-SMT680	TE	获取价格	Ultra-Low Phase Noise