Datasheet > MLPF-WB-02D3

MLPF-WB-02D3

更新时间： 2024-09-16 14:57:27

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
13页	2313K
描述
2.4 GHz低通滤波器搭配STM32WB5x和STM32WB1x，采用WLCSP和UFBGA封装

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MLPF-WB-02D3 数据手册

MLPF-WB-02D3

Datasheet

2.4 GHz low pass filter matched to STM32WB5x and STM32WB1x

in WLCSP and UFBGA packages

Features

•

Integrated impedance matching to STM32WB5x and STM32WB1x in WLCSP

and UFBGA packages

•

50 Ω nominal impedance on antenna side

Deep rejection harmonics filter

Low insertion loss

Chip scale package on glass 6 bumps

Small footprint

Pin-out top diagram (top view - bumps down)

Low profile ≤ 630 μm after reflow

High RF performances

OUT

GND3

GND2

GND1

RF BOM and area reduction

ECOPACK2 compliant component

GND4

Applications

•

Bluetooth 5

OpenThread

Zigbee®

IEEE 802.15.4

Optimized for STM32WB5x and STM32WB1x in WLCSP and UFBGA

packages

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Description

MLPF-WB-02D3

The MLPF-WB-02D3 integrates an impedance matching network and harmonics

filter. The matching impedance network has been tailored to maximize the RF

performances of STM32WB5x and STM32WB1x in WLCSP and UFBGA packages.

This device uses STMicroelectronics IPD technology on non-conductive glass

substrate which optimizes RF performances.

DS14042 - Rev 2 - November 2022

www.st.com

For further information contact your local STMicroelectronics sales office.

12 3 4 5 6 7...13

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