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ML7001-01MA PDF预览

ML7001-01MA

更新时间: 2024-02-10 08:59:11
品牌 Logo 应用领域
冲电气 - OKI /
页数 文件大小 规格书
19页 145K
描述
Single Rail CODEC

ML7001-01MA 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:SSOP, SOP20,.25,40Reach Compliance Code:unknown
风险等级:5.9压伸定律:A/MU-LAW
滤波器:YESJESD-30 代码:R-PDSO-G20
JESD-609代码:e0线性编码:NOT AVAILABLE
功能数量:1端子数量:20
最高工作温度:85 °C最低工作温度:-30 °C
封装主体材料:PLASTIC/EPOXY封装代码:SSOP
封装等效代码:SOP20,.25,40封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, SHRINK PITCH电源:3 V
认证状态:Not Qualified子类别:Codecs
最大压摆率:10 mA标称供电电压:3 V
表面贴装:YES技术:CMOS
电信集成电路类型:PCM CODEC温度等级:OTHER
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:1 mm端子位置:DUAL
Base Number Matches:1

ML7001-01MA 数据手册

 浏览型号ML7001-01MA的Datasheet PDF文件第13页浏览型号ML7001-01MA的Datasheet PDF文件第14页浏览型号ML7001-01MA的Datasheet PDF文件第15页浏览型号ML7001-01MA的Datasheet PDF文件第16页浏览型号ML7001-01MA的Datasheet PDF文件第17页浏览型号ML7001-01MA的Datasheet PDF文件第18页 
¡ Semiconductor  
ML7000-01/02/03/ML7001-01/02/03  
(Unit : mm)  
SSOP20-P-250-0.95-K  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
0.18 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
19/19  

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