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ML22Q665 PDF预览

ML22Q665

更新时间: 2023-09-03 20:25:19
品牌 Logo 应用领域
罗姆 - ROHM 语音合成放大器PC驱动控制器微控制器存储转换器
页数 文件大小 规格书
125页 3598K
描述
ML226xx系列是内置有4Mbit~32Mbit Flash存储器的语音合成LSI。由于内置了大容量存储器,因此非常适用于语音操作指导等需要长时间播放语音的应用。此外,该系列产品还支持通过微控制器改写Flash存储器。产品采用实现高音质的HQ-ADPCM、16位D/A转换器和低通滤波器,并内置用来直接驱动扬声器的1.0W单声道扬声器放大器。语音输出所需的功能已经全部集成于1枚芯片中,因此仅需增加本LSI,即可轻松实现语音功能。

ML22Q665 数据手册

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FEDL22Q66X-06  
ML22Q66X  
Notes  
1) The information contained herein is subject to change without notice.  
2) When using LAPIS Technology Products, refer to the latest product information (data sheets, user’s manuals, application  
notes, etc.), and ensure that usage conditions (absolute maximum ratings, recommended operating conditions, etc.) are within  
the ranges specified. LAPIS Technology disclaims any and all liability for any malfunctions, failure or accident arising out of  
or in connection with the use of LAPIS Technology Products outside of such usage conditions specified ranges, or without  
observing precautions. Even if it is used within such usage conditions specified ranges, semiconductors can break down and  
malfunction due to various factors. Therefore, in order to prevent personal injury, fire or the other damage from break down or  
malfunction of LAPIS Technology Products, please take safety at your own risk measures such as complying with the  
derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures.  
You are responsible for evaluating the safety of the final products or systems manufactured by you.  
3) Descriptions of circuits, software and other related information in this document are provided only to illustrate the standard  
operation of semiconductor products and application examples. You are fully responsible for the incorporation or any other  
use of the circuits, software, and information in the design of your product or system. And the peripheral conditions must be  
taken into account when designing circuits for mass production. LAPIS Technology disclaims any and all liability for any  
losses and damages incurred by you or third parties arising from the use of these circuits, software, and other related  
information.  
4) No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of LAPIS Technology  
or any third party with respect to LAPIS Technology Products or the information contained in this document (including but  
not limited to, the Product data, drawings, charts, programs, algorithms, and application examples, etc.). Therefore LAPIS  
Technology shall have no responsibility whatsoever for any dispute, concerning such rights owned by third parties, arising out  
of the use of such technical information.  
5) The Products are intended for use in general electronic equipment (AV/OA devices, communication, consumer systems,  
gaming/entertainment sets, etc.) as well as the applications indicated in this document. For use of our Products in applications  
requiring a high degree of reliability (as exemplified below), please be sure to contact a LAPIS Technology representative and  
must obtain written agreement: transportation equipment (cars, ships, trains, etc.), primary communication equipment, traffic  
lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems, etc.  
LAPIS Technology disclaims any and all liability for any losses and damages incurred by you or third parties arising by using  
the Product for purposes not intended by us. Do not use our Products in applications requiring extremely high reliability, such  
as aerospace equipment, nuclear power control systems, and submarine repeaters, etc.  
6) The Products specified in this document are not designed to be radiation tolerant.  
7) LAPIS Technology has used reasonable care to ensure the accuracy of the information contained in this document. However,  
LAPIS Technology does not warrant that such information is error-free and LAPIS Technology shall have no responsibility  
for any damages arising from any inaccuracy or misprint of such information.  
8) Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive.  
LAPIS Technology shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws  
or regulations.  
9) When providing our Products and technologies contained in this document to other countries, you must abide by the  
procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export  
Administration Regulations and the Foreign Exchange and Foreign Trade Act..  
10) Please contact a ROHM sales office if you have any questions regarding the information contained in this document or LAPIS  
Technology's Products.  
11) This document, in part or in whole, may not be reprinted or reproduced without prior consent of LAPIS Technology.  
(Note) “LAPIS Technology” as used in this document means LAPIS Technology Co., Ltd.  
Copyright 2020 – 2022 LAPIS Technology Co., Ltd.  
2-4-8 Shinyokohama, Kouhoku-ku, Yokohama 222-8575, Japan  
https://www.lapis-tech.com/en/  
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