ML145583
LANSDALE Semiconductor, Inc.
OUTLINE DIMENSIONS
SOIC 28W = -7P
(ML145583-7P)
SOG PACKAGE
CASE 751F–04
-A-
NOTES:
28
1
15
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
14X P
M
M
-B-
0.010 (0.25)
B
14
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
28X D
M
M
S
S
0.010 (0.25)
T
A
B
R X 45°
MILLIMETERS
INCHES
C
DIM
A
B
C
D
F
G
J
K
M
P
R
MIN
17.80
7.40
2.35
0.35
0.41
1.27 BSC
0.23
0.13
MAX
18.05
7.60
2.65
0.49
0.90
MIN
MAX
0.711
0.299
0.104
0.019
0.035
-T-
0.701
0.292
0.093
0.014
0.016
-T-
26X G
SEATING
PLANE
K
F
0.050 BSC
0.009
0.005
0.32
0.29
0.013
0.011
8°
0.415
0.029
J
0°
8°
0°
10.05
0.25
10.55
0.75
0.395
0.010
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ity, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the cus-
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