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MKT1817233404D PDF预览

MKT1817233404D

更新时间: 2022-09-29 12:14:59
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
14页 166K
描述
CAP FILM 3300PF 5% 400VDC RADIAL

MKT1817233404D 数据手册

 浏览型号MKT1817233404D的Datasheet PDF文件第5页浏览型号MKT1817233404D的Datasheet PDF文件第6页浏览型号MKT1817233404D的Datasheet PDF文件第7页浏览型号MKT1817233404D的Datasheet PDF文件第9页浏览型号MKT1817233404D的Datasheet PDF文件第10页浏览型号MKT1817233404D的Datasheet PDF文件第11页 
Not for New Designs - Alternative Device: MKT370  
MKT1817  
Vishay Roederstein  
www.vishay.com  
HEAT CONDUCTIVITY (G) AS A FUNCTION OF (ORIGINAL) PITCH AND CAPACITOR BODY  
THICKNESS IN mW/°C  
HEAT CONDUCTIVITY (mW/°C)  
Wmax.  
(mm)  
PITCH 5 mm  
2.ꢀ  
3.0  
4.ꢀ  
6.0  
2.ꢀ  
3.0  
4.0  
ꢀ.ꢀ  
POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE  
The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function  
of the free ambient temperature.  
The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film  
Capacitors”.  
The component temperature rise (T) can be measured (see section “Measuring the Component Temperature” for more details)  
or calculated by T = P/G:  
T = component temperature rise (°C)  
• P = power dissipation of the component (mW)  
• G = heat conductivity of the component (mW/°C)  
MEASURING THE COMPONENT TEMPERATURE  
A thermocouple must be attached to the capacitor body as in:  
Thermocouple  
The temperature is measured in unloaded (Tamb) and maximum loaded condition (TC).  
The temperature rise is given by T = TC - Tamb.  
To avoid radiation or convection, the capacitor should be tested in a wind-free box.  
Revision: 11-Jan-18  
Document Number: 26032  
8
For technical questions, contact: dc-film@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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