Datasheet > MKP1840210103MW

MKP1840210103MW

更新时间： 2022-03-26 08:55:38

品牌	Logo	应用领域
威世 - VISHAY		电容器薄膜电容器脉冲
页数	文件大小	规格书
13页	133K
描述
AC and Pulse Metallized Polypropylene Film Capacitors MKP Radial Potted Type

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MKP1840210103MW 数据手册

MKP 1840 M

AC and Pulse Metallized Polypropylene Film Capacitors

MKP Radial Potted Type

Vishay Roederstein

HEAT CONDUCTIVITY (G) AS A FUNCTION OF ORIGINAL PITCH AND CAPACITOR BODY

THICKNESS IN mW/°C

HEAT CONDUCTIVITY (mW/°C)

PITCH 10 mm PITCH 15 mm PITCH 22.5 mm PITCH 27.5 mm PITCH 37.5 mm

W_max.

(mm)

PITCH 5 mm

PITCH 7.5 mm

3.0

3.5

2.5

4.0

3.5

4.0

5.0

6.0

4.5

5.5

6.5

5.0

6.5

5.5

6.5

7.5

9.0

5.7

6.0

10.5

6.5

9.0

11.5

17.0

7.5

13.5

19.0

8.5

15.0

16.5

9.0

22.5

10.5

11.0

11.5

13.5

14.5

15.0

16.5

18.0

20.0

26.5

30.5

33.5

41.0

52.0

45.0

57.0

67.0

75.5

99.0

POWER DISSIPATION AND MAXIMUM COMPONENT TEMPERATURE RISE

The power dissipation must be limited in order not to exceed the maximum allowed component temperature rise as a function of

the free air ambient temperature.

The power dissipation can be calculated according type detail specification “HQN-384-01/101: Technical Information Film

Capacitors” with the typical tgd of the curves.

The component temperature rise (ΔT) can be measured (see section “Measuring the Component Temperature” for more details)

or calculated by ΔT = P/G:

• ΔT = Component temperature rise (°C)

• P = Power dissipation of the component (mW)

• G = Heat conductivity of the component (mW/°C)

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154

For technical questions, contact: dc-film@vishay.com

Document Number: 26018

Revision: 01-Jul-10

1...5 6 789 10 11...13

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