Datasheet > MIP2012H2R2MBE

MIP2012H2R2MBE

更新时间： 2024-04-09 18:58:21

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
8页	973K
描述
Multi-Layer Power Inductor / MIP Series 2.2, 900mA

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MIP2012H2R2MBE 数据手册

9. Land Patterns Reflow Soldering



Solder Land Information

Solder land information：

Size (mm)

1608

2012

0.5 ~ 0.7

1.0 ~ 1.2

1.8 ~ 2.0

3.0 ~ 4.0

0.65 ~ 0.95

1.0 ~1.4

10. Reliability Performance

Test item

Test condition

Criteria

1. More than 95 % of terminal

electrode should be covered

with new solder

1. Solder temperature : 260 ± 5℃

2. Flux : Rosin

3. DIP time : 10 ± 1 sec

Resistance to Solder Heat

2. No mechanical damage

3. Inductance value should be

within ± 20 % of the initial

value

1. More than 95 % of terminal

electrode should be covered

with new solder

1. Solder temperature : 235 ± 5℃

2. Flux : Rosin

3. DIP time : 5 ± 1 sec

Solderability

2. No mechanical damage

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