CHIP RESISTOR
项目
标 准
测试方法 (IEC60115-1)
Test Methods (IEC60115-1)
Item
Specifications
IEC 60115-1 4.17
245℃±5℃锡槽,保持3s±0.3s
Lead-free solder bath at 245℃±5℃ for 3s±0.3s.
可焊性
Solderability
可焊面积≥95%
95% Cover Min
。
无可见损伤
No mechanical damage
△R≤±1.0%R
IEC 60115-1 4.18
270℃±5℃锡槽,保持10s±1s。
Lead-free solder bath at 270℃±5℃ for 10s±1s.
耐焊接热
Resistance to
Soldering Heat
IEC 60115-1 4.33
基板弯曲试验
Substrate
Bending Test
无可见损伤
No mechanical damage
弯曲距离(Bending distance):
0603、0805、1206、0612:3mm
保持时间(Duration):60s±5s.
△R≤±1.0%R
在规定值内
IEC 60115-1 4.8
电阻温度系数
Within specified T.C.R
T.C.R
+25℃/+125℃/+25℃
IEC 60115-1 4.19
-55℃(30分钟)~常温(≤1分钟)~155℃(30分钟) 1000个循环。
温度快速变化
Rapid Change of
Temperature
无可见损伤
No mechanical damage
-55℃(30min)~normal temperature(≤1min)~155℃(30min)
△R≤±1.0%R
1000 cycles.
IEC 60115-1 4.13
5倍额定功率,持续5秒。
无可见损伤
No mechanical damage
≤±1.0%R
短时间过负载
Short Time Overload
5× rated power for 5s
△R
IEC 60115-1 4.24
稳态湿热
Damp Heat
Steady State
无可见损伤
No mechanical damage
△R≤±1.0%R
40℃±2℃,93%±3%RH,1000小时,额定电流或元件极限电流(取最小值),
通1.5小时/断0.5小时。
40℃±2℃,93%±3%RH,1000h,rated current or limiting element
current whichever is lower for 1.5h ON/0.5h OFF.
IEC 60115-1 4.25.1
无可见损伤
70℃±2
℃,1000小时,额定电流或元件极限电流(取最小值),
70℃耐久性
Endurance at 70℃
No mechanical damage 通1.5小时/断0.5小时
。
70℃± ℃,1000h,rated current or limiting element current
2
△R≤± 1.0%R
whichever is lower for 1.5h ON/0.5h OFF.
上限类别温度耐久性
Endurance at Upper
Category Temperature
无可见损伤
No mechanical damage
≤± 1.0%R
IEC 60115-1 4.25.3
155℃±2℃,1000小时。
155℃±2℃,1000h
△R
IEC 60115-1 4.6
在电极与基片间施加100V±15V直流电压,保持1分钟,然后测绝缘电阻
阻值。
绝缘电阻
Insulation Resistance
Resistance
1000MΩ
Apply DC 100V±15V between substrate and terminations for
lmin, then check insulation resistance.
IEC 60115-1. 4.7
在电极与基片间以大约100V/s的速率施加有效值为最大过负荷电压的交流电压
无击穿或飞弧
No breakdown
or flashover
耐电压
Voltage Proof
(0603:150V
,0805:300V,1206、0612:400V),保持 60s±5s。
Apply max.overload voltage of AC RMS at a rate of approximately
100V/s between substrate and terminations for 60s±5s.
IIEC 60115-1 4.29
异丙醇(IPA),23℃±5℃,浸10小时。
Iso-propyl alcohol(IPA),23℃±5℃,10h.
耐溶剂
Component Solvent
无可见损伤
No mechanical damage
Resistance
△R≤±1.0%R
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