MHU07N65
Chip Integration Technology Corporation
Silicon N-Channel Power MOSFET
Main Product Characteristics
■ Outline
TO-251
ID
7A
VDSS
PD(TC=25oC)
650V
95W
1.1Ω
RDS(ON)Typ
■ Features
• Fast switching.
• ESD improved capability.
• Low gate charge. (Typical Data:24nC)
• Low reverse transfer capacitances.(Typical:4.5pF)
• 100% single pulse avalanche energy test.
1.Gate 2.Drain 3.Source
Drain
■ Application
• Power switch circuit of adaptor and charger.
■ Mechanical data
Gate
• Epoxy:UL94-V0 rated flame retardant
• Case : JEDEC TO-251 molded plastic body over
passivated chip
• Lead : Axial leads, solderable per MIL-STD-202,
Method 208 guranteed.
Source
Inner Equivalent principium Chart
■ Absolute(TC = 25OC unless otherwise specified)
Symbol
VDSS
PARAMETER
CONDITIONS
MHU07N65
UNIT
V
Drain-to-Source Voltage
650
Continuous Drain Current
7
ID
TC = 100OC
A
Continuous Drain Current
4.5
IDM
VGS
EAS
IAR
Pulsed Drain Current(Note:1)
Gate-to-Source Voltage
28
±30
V
mJ
A
Single Pulse Avalanche Energy(Note:2)
Avalanche Current(Note:1)
450
3.3
Avalanche Energy, Repetitive(Note:1)
EAR
54
mJ
Power Dissipation
Derating factor above 25OC
95
0.76
W
Power Dissipation
PD
W/OC
V/ns
V
OC
OC
Peak Diode Recovery dv/dt(Note:3)
Gate source ESD
dV/dt
VESD(G-S)
TJ, TSTG
TL
5.0
HBM-C = 100pF, R = 1.5kΩ
3000
Operating Junction and Storage Temperature Range
Maximum temperature for soldering
150,-55 ~ +150
300
NOTE : 1.Repetitive rating; pulse width limited by maximum junction temperature.
2.L=10.0mH, ID = 6.3A, Start TJ = 25OC.
3.ISD =4A,di/dt ≤100A/µs, VDD≤BVDS, Start TJ = 25OC.
Document ID : DS-22M75
Revised Date : 2015/08/24
Revision : C
1