CHIP RESISTOR
项目
标 准
测试方法
Item
Specifications
Test Methods
IEC 60115-1 4.17
245℃±5℃锡槽,保持3s±0.3s.
Lead-free solder bath at 245℃±5℃ for 3s±0.3s.
可焊性
Solderability
可焊面积≥95%
95% Cover Min
耐焊接热
无可见损伤
IEC 60115-1 4.18
Resistance to
Soldering Heat
No mechanical damage
270℃±5℃锡槽,保持10s±1s.
Lead-free solder bath at 270℃±5℃ for 10s±1s.
Max.0.5m
Ω
基板弯曲试验
Substrate
Bending Test
无可见损伤
No mechanical damage
IEC 60115-1 4.33
弯曲距离(Bending distance):2mm
保持时间(Duration):60s±5s.
Max.0.5m
Ω
IEC 60115-1 4.19
-55℃(30分钟)~常温(5分钟)~125℃(30分钟) 5个循环。
-55℃(30min)~normal temperature(5min)~125℃(30min) ,5 cycles.
温度快速变化
Rapid Change of
Temperature
无可见损伤
No mechanical damage
Max.0.5m
Ω
IEC 60115-1 4.13
2.5倍额定功率,保持5秒。
2.5×Rated Power,for 5 s.
无可见损伤
No mechanical damage
短时间过负载
Short Time Overload
Max.0.5m
Ω
IEC 60115-1 4.24
稳态湿热
无可见损伤
40℃±2℃,93%±3%RH,1000h
40℃±2℃,93%±3%RH,1000h
Damp Heat
Steady State
No mechanical damage
Max.0.5m
Ω
无可见损伤
No mechanical damage
IEC 60115-1 4.25.1
70℃耐久性
Endurance at 70℃
70℃±
70℃±
2
2
℃,1000小时,额定电流通1.5小时/断0.5小时。
℃,1000h rated current for 1.5h ON/0.5h OFF.
Max.0.5m
Ω
,
IEC 60115-1 4.25.3
上限类别温度耐久性
无可见损伤
Endurance at Upper
Category Temperature
No mechanical damage
155℃±2℃,1000小时。
155℃±2℃,1000h
Max.0.5m
Ω
单位 unit: mm
型号Type
A
B
C
C
0603
0805
1206
2512
0.3
0.4
1.0
1.4
1.8
3.4
2.8
3.2
4.4
8.0
A
B
0.4
1.0
包装方式见附录
Packaging can refer to the Appendix.
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