Features
Applications
■ Compact design to save board space -
■ USB port protection - USB 2.0, 3.0 & OTG
■ HDMI 1.4 Source protection
0805 footprint
■ Small size results in very fast time to react
to fault events
■ Symmetrical design
■ Low profile
■ RoHS compliant* and halogen free**
■ Agency recognition:
■ PC motherboards - Plug and Play
protection
■ Mobile phones - Battery and port protection
■ PDAs / digital cameras
■ Game console port protection
MF-PSMF Series - PTC Resettable Fuses
Electrical Characteristics
Tripped
Power
Dissipation
Max. Time
To Trip
I
I
Resistance
hold
trip
V max.
I max.
Amps
Model
Volts
Amperes
Ohms
at 23 °C
R
Amperes
Seconds
at 23 °C
Watts
at 23 °C
at 23 °C
at 23 °C
R
1.0
0.65
Hoꢂd
Trip
0.30
0.50
0.75
1.00
1.50
2.20
Tꢁp.
0.5
0.5
0.5
0.5
0.6
0.6
Min.
1Max.
7.5
3.5
MF-PSMF010X
MF-PSMF020X
MF-PSMF035X
MF-PSMF050X
MF-PSMF075X
MF-PSMF110X
15
9
6
6
6
40
40
40
40
40
40
0.10
0.20
0.35
0.50
0.75
1.10
0.5
1.5
8.00
8.00
8.00
8.00
8.00
0.02
0.10
0.10
0.20
0.30
0.250
0.150
0.090
0.060
1.200
0.900
0.350
0.210
6
Environmental Characteristics
Operating Temperature......................................... -40 °C to +85 °C
Maximum Device Surface Temperature
in Tripped State .................................................... 125 °C
Passive Aging....................................................... +85 °C, 1000 hours............................................... 5 ꢀ tꢁpicaꢂ resistance change
Humiditꢁ Aging..................................................... +85 °C, 85 ꢀ R.H. 1000 hours............................. 5 ꢀ tꢁpicaꢂ resistance change
Thermaꢂ Shock ..................................................... +85 °C to -40 °C, 20 times ................................... 10 ꢀ tꢁpicaꢂ resistance change
Soꢂvent Resistance............................................... MIL-STD-202, Method 215................................... No change
Vibration ............................................................... MIL-STD-883C, Method 2007.1,.......................... No change
Condition A
Test Procedures And Requirements For Model MF-PSMF Series
Test
Test Conditions
Accept/Reject Criteria
Visuaꢂ/Mech.......................................................... Verifꢁ dimensions and materiaꢂs........................... Per MF phꢁsicaꢂ description
Resistance............................................................ In stiꢂꢂ air @ 23 °C.................................................. Rmin ≤ R ≤ R1max
Time to Trip........................................................... At specified current, Vmax, 23 °C ........................ T ≤ max. time to trip (seconds)
Hoꢂd Current......................................................... 30 min. at Ihoꢂd..................................................... No trip
Trip Cꢁcꢂe Life....................................................... Vmax, Imax, 100 cꢁcꢂes........................................ No arcing or burning
Trip Endurance ..................................................... Vmax, 48 hours..................................................... No arcing or burning
Soꢂderabiꢂitꢁ.......................................................... ANSI/J-STD-002................................................... 95 ꢀ min. coverage
UL Fiꢂe Number .................................................... E174545
http://www.uꢂ.com/ Foꢂꢂow ꢂink to Certifications, then UL Fiꢂe No., enter E174545
Thermal Derating Chart - I
(Amps)
hold
Ambient Operating Temperature
Model
-40 °C
-20 °C
0.13
0.25
0.44
0.62
0.90
1.35
0 °C
0.12
0.23
0.39
0.55
0.79
1.20
23 °C
0.10
0.20
0.35
0.50
0.75
1.10
40 °C
0.09
0.17
0.30
0.40
0.63
0.92
50 °C
0.08
0.14
0.27
0.37
0.57
0.84
60 °C
0.07
0.12
0.24
0.33
0.53
0.75
70 °C
0.06
0.10
0.20
0.29
0.42
0.65
85 °C
0.05
0.07
0.14
0.23
0.35
0.52
MF-PSMF010X
MF-PSMF020X
MF-PSMF035X
MF-PSMF050X
MF-PSMF075X
MF-PSMF110X
0.15
0.28
0.47
0.68
1.00
1.45
*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex.
**To be considered halogen free, each homogenous material can have a maximum concentration of 900 ppm of either bromine or chlorine.
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.