DiskOnChip 2000 DIP
TABLE OF CONTENTS
1. Introduction ...............................................................................................................................5
2. Product Overview......................................................................................................................6
2.1 Product Description ............................................................................................................6
2.2 I/O Operation......................................................................................................................7
2.3 Pin Diagram........................................................................................................................7
2.4 Signal Descriptions.............................................................................................................8
3. Theory of Operation ..................................................................................................................9
3.1 Overview.............................................................................................................................9
3.2 System Interface.................................................................................................................9
3.3 Boot Block ........................................................................................................................10
3.4 Error Detection Code/Error Correction Code (EDC/ECC)................................................10
3.5 Flash Control ....................................................................................................................10
4. Operating Modes.....................................................................................................................11
5. TrueFFS Technology...............................................................................................................12
5.1 General Description..........................................................................................................12
5.1.1 Built-In Operating System Support..................................................................................... 13
5.1.2 TrueFFS Software Development Kit (SDK)........................................................................ 13
5.1.3 File Management................................................................................................................ 13
5.1.4 Bad-Block Management..................................................................................................... 13
5.1.5 Wear-Leveling .................................................................................................................... 13
5.2 Power Failure Management .............................................................................................14
5.2.1 Error Detection/Correction.................................................................................................. 14
5.2.2 Special Features through I/O Control (IOCTL) Mechanism............................................... 15
5.2.3 Compatibility....................................................................................................................... 15
5.3 8KB Memory Window.......................................................................................................16
6. Booting from DiskOnChip 2000 .............................................................................................17
6.1 Introduction.......................................................................................................................17
6.2 Boot Procedure in PC-Compatible Platforms ...................................................................17
7. Design Considerations ...........................................................................................................19
7.1 Design Environment .........................................................................................................19
7.2 System Interface...............................................................................................................19
7.3 Connecting Signals...........................................................................................................20
7.4 Platform-Specific Issues...................................................................................................20
7.4.1 Wait State........................................................................................................................... 20
3
Data Sheet, Rev. 3.9
91-SR-002-42-8L
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