Datasheet > MD16R1624AF0-CN9

MD16R1624AF0-CN9

更新时间： 2023-01-02 17:43:00

品牌	Logo	应用领域
三星 - SAMSUNG		动态存储器
页数	文件大小	规格书
16页	201K
描述
Rambus DRAM Module, 32MX32, CMOS, RIMM-232

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中文翻译

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数据手册

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MD16R1624AF0-CN9 数据手册

Preliminary

MD16R1624(8/G)AF0

MD18R1624(8/G)AF0

32 Bit RIMM^®Module

Overview

Key Timing Parameters

T h e 3 2 b i t R I M M module is a general purpose high-perfor-

The following table lists the frequency and latency bins

a v a i l a b l e f o r 3 2 b i t R I M M m o d u l e s .

mance line of memory modules suitable for use in a broad

range of applications including computer memory, personal

computers, workstations, and other applications where high

bandwidth and low latency are required.

Table 1: 32 bit RIMM Module Frequency and Latency

T h e 3 2 b i t R I M M m o d u l e c o n s i s t s o f 2 5 6 M b / 2 8 8 M b

R D R A M devices. These are extremely high-speed CMOS

S p e e d

D R A M s o r g a n i z e d a s 1 6 M w o r d s b y 1 6 o r 1 8 b i t s . T h e u s e

o f R a m b u s S i g n a l i n g L e v e l ( R S L ) t e c h n o l o g y p e r m i t s t h e

use of conventional system and board design technologies.

R I M M 3 2 0 0 m o d u l e s s u p p o r t 8 0 0 M H z t r a n s f e r r a t e p e r p i n ,

resulting in total module bandwidth of 3200MB/s or

3 . 2 G B / s . R I M M 4 2 0 0 m o d u l e s s u p p o r t 1 0 6 6 M H z t r a n s f e r

rate per pin, resulting in total module bandwidth of

4 2 0 0 M B / s o r 4 . 2 G B / s .

RAC

O r g a n i -

( R o w

A c c e s s

T i m e )

n s

P a r t N u m b e r

I / O F r e q .

( M H z )

z a t i o n

M D 1 6 / 1 8 R 1 6 2 4 A F 0 - C N 9

M D 1 6 / 1 8 R 1 6 2 4 A F 0 - C M 9

M D 1 6 / 1 8 R 1 6 2 8 A F 0 - C N 9

M D 1 6 / 1 8 R 1 6 2 8 A F 0 - C M 9

M D 1 6 / 1 8 R 1 6 2 G A F 0 - C N 9

M D 1 6 / 1 8 R 1 6 2 G A F 0 - C M 9

3 2 M

1 0 6 6 M H z

3 2 / 3 6

T h e 3 2 b i t R I M M m o d u l e p r o v i d e s t w o i n d e p e n d e n t 1 6 o r 1 8

bit memory channels to facilitate compact system design.

The "Thru" Channel enters and exits the module to support a

connection to or from a controller, memory slot, or termina-

t i o n . T h e " T e r m " C h a n n e l i s t e r m i n a t e d o n t h e m o d u l e a n d

supports a connection from a controller or another memory

slot.

6 4 M

R I M M 4 2 0 0

3 2 / 3 6

1 2 8 M

3 2 / 3 6

3 2 M

M D 1 6 / 1 8 R 1 6 2 4 A F 0 - C M 8

M D 1 6 / 1 8 R 1 6 2 8 A F 0 - C M 8

M D 1 6 / 1 8 R 1 6 2 G A F 0 - C M 8

3 2 / 3 6

T h e R D R A M a r c h i t e c t u r e e n a b l e s t h e h i g h e s t s u s t a i n e d

bandwidth for multiple, simultaneous, randomly addressed

memory transactions. The separate control and data buses

w i t h i n d e p e n d e n t r o w a n d c o l u m n c o n t r o l y i e l d o v e r 9 5 %

bus efficiency. The RDRAM device multi-bank architecture

supports up to four simultaneous transactions per device.

6 4 M

R I M M 3 2 0 0

8 0 0 M H z

3 2 / 3 6

1 2 8 M

3 2 / 3 6

Features

2 I n d e p e n d e n t R D R A M c h a n n e l s , 1 p a s s t h r o u g h a n d 1

t e r m i n a t e d o n 3 2 b i t R I M M m o d u l e

Form Factor

H i g h s p e e d 8 0 0 a n d 1 0 6 6 M H z R D R A M d e v i c e s

2 3 2 e d g e c o n n e c t o r p a d s w i t h 1 m m p a d s p a c i n g

M o d u l e P C B s i z e : 1 3 3 . 3 5 m m x 3 4 . 9 3 m m x 1 . 2 7 m m

(5. 25” x 1. 375” x 0. 05” )

T h e 3 2 b i t R I M M m o d u l e s a r e o f f e r e d i n 2 3 2 - p a d 1 m m e d g e

c o n n e c t o r p a d p i t c h s u i t a b l e f o r 2 3 2 c o n t a c t R I M M c o n n e c -

t ors.

Gold plated edge connector pad contacts

Serial Presence Detect (SPD) support

Operates from a 2. 5 volt supply (±5 % )

L o w p o w e r a n d p o w e r d o w n s e l f r e f r e s h m o d e s

S e p a r a t e R o w a n d C o l u m n b u s e s f o r h i g h e r e f f i c i e n c y

Figure 1 : 32 bit RIMM module with heat spreader

Page1

Version 1.0 July 2002

12 3 4 5 6 7...16

中文翻译

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与MD16R1624AF0-CN9相关器件

型号	品牌	获取价格	描述	数据表
MD16R1624DF0-CK8	SAMSUNG	获取价格	Rambus DRAM Module, 32MX32, CMOS, RIMM-232
MD16R1624DF0-CM9	SAMSUNG	获取价格	Rambus DRAM Module, 32MX32, CMOS, RIMM-232
MD16R1624DF0-CN1	SAMSUNG	获取价格	Rambus DRAM Module, 32MX32, 32ns, CMOS, RIMM-232
MD16R1624DF0-CN9	SAMSUNG	获取价格	Rambus DRAM Module, 32MX32, CMOS, RIMM-232
MD16R1624EG0-CM8	SAMSUNG	获取价格	Rambus DRAM Module, 32MX32, 40ns, CMOS, RIMM-232
MD16R1624EG0-CN1	SAMSUNG	获取价格	Rambus DRAM Module, 32MX32, 32ns, CMOS, RIMM-232
MD16R1624EG0-CT9	SAMSUNG	获取价格	Rambus DRAM Module, 32MX32, 32ns, CMOS, RIMM-232
MD16R1628AF0-CM8	SAMSUNG	获取价格	Rambus DRAM Module, 64MX32, CMOS, RIMM-232
MD16R1628AF0-CM9	SAMSUNG	获取价格	Rambus DRAM Module, 64MX32, CMOS, RIMM-232
MD16R1628DF0-CM8	SAMSUNG	获取价格	Rambus DRAM Module, 64MX32, CMOS, RIMM-232

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