Datasheet > MCQD08N06

MCQD08N06

更新时间： 2023-12-06 20:06:25

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
5页	1520K
描述
Tape&Reel:4Kpcs/Reel;

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数据手册

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MCQD08N06 数据手册

MCQD08N06

Features

•

High Density Cell Design for Low R_DS(on)

Epoxy Meets UL 94 V-0 Flammability Rating

Moisture Sensitivity Level 3

Halogen Free. “Green” Device^（Note1）

Dual N-Channel

Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS

Compliant. See Ordering Information)

Power MOSFET

Maximum Ratings

•

Operating Junction Temperature Range : -55°C to +150°C

Storage Temperature Range: -55°C to +150°C

•

Thermal Resistance: 13.5°C/W Junction to Case

SOP-8

Thermal Resistance: 77°C/W Junction to Ambient^{(Note 2)}

Parameter

Rating

Symbol

V_DS

V_GS

I_D

Unit

Drain-Source Voltage

Gate-Source Volltage

Continuous Drain Current

±20

Pulsed Drain Current ^{(Note 3)}

Total Power Dissipation

I_DM

P_D

9.2

Note:

1.Halogen free "Green” products are defined as those which contain

<900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

2.The Value of R_θJAis Measured with the Device Mounted on 1 in²FR-4

Board with 2oz. Copper, in a Still Air Environment with T_A=25°C.

3.Repetitive Rating; Pulse Width Limited by Maximum Junction

Temperature.

DIMENSIONS

INCHES

DIM

NOTE

MIN MAX MIN MAX

0.053 0.069 1.35 1.75

0.004 0.010 0.10 0.25

0.053 0.061 1.35 1.55

0.013 0.020 0.33 0.51

0.007 0.010 0.17 0.25

0.185 0.200 4.70 5.10

0.050

1.270

TYP.

Internal Structure and Marking Code

0.228 0.244 5.80 6.20

0.150 0.157 3.80 4.00

0.016 0.050 0.40 1.27

0°

8°

0°

8°

Suggested Solder Pad Layout

4.61mm

QD08N06

6.50mm

1.50mm

0.80mm

1.27mm

Rev.3-2-09262022

1/5

MCCSEMI.COM

12 3 4 5

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