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MCIMX508CVK8B PDF预览

MCIMX508CVK8B

更新时间: 2024-01-07 10:24:38
品牌 Logo 应用领域
飞思卡尔 - FREESCALE 外围集成电路
页数 文件大小 规格书
134页 2581K
描述
i.MX50 Applications Processors for Consumer Products

MCIMX508CVK8B 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred零件包装代码:BGA
包装说明:13 X 13 MM, 0.5 MM PITCH, ROHS COMPLIANT, PLASTIC, MABGA-416针数:416
Reach Compliance Code:unknownECCN代码:5A002
HTS代码:8542.31.00.01风险等级:5.72
其他特性:ALSO OPERATES AT 0.9 V MINIMUM SUPPLY 24 MHZJESD-30 代码:S-PBGA-B416
JESD-609代码:e1长度:13 mm
湿度敏感等级:3端子数量:416
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:LFBGA
封装等效代码:BGA416,24X24,20封装形状:SQUARE
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
电源:0.95/1.225 V认证状态:Not Qualified
座面最大高度:1.52 mm子类别:Graphics Processors
最大压摆率:185 mA最大供电电压:1.275 V
最小供电电压:1.175 V标称供电电压:1.225 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:0.5 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:13 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT
Base Number Matches:1

MCIMX508CVK8B 数据手册

 浏览型号MCIMX508CVK8B的Datasheet PDF文件第2页浏览型号MCIMX508CVK8B的Datasheet PDF文件第3页浏览型号MCIMX508CVK8B的Datasheet PDF文件第4页浏览型号MCIMX508CVK8B的Datasheet PDF文件第6页浏览型号MCIMX508CVK8B的Datasheet PDF文件第7页浏览型号MCIMX508CVK8B的Datasheet PDF文件第8页 
Introduction  
– USBOH1 (USB OTG and host controller complex)  
– FEC Ethernet controller  
MAX AHB crossbar (133 MHz)—This connects the various AHB bus sub-segments in the system  
and provides decode into the following slaves:  
— IP-Bus 1 (66 MHz)—This bus segment contains peripherals accessible by the ARM core and  
without DMA capability  
— IP-Bus 2 (66 MHz)—This bus segment contains peripherals accessible by the ARM core and  
without DMA capability  
— APBH DMA bridge (133 MHz)—The APBH DMA bridge is a master to the MAX for its  
memory-side DMA operations. The APBH bus is an AMBA APB slave bus providing  
peripheral access to many of the high-speed IP blocks on the i.MX50.  
IP-Bus 3 (66 MHz)—This third peripheral bus segment contains peripherals accessible by the  
ARM core and SDMA and as such houses peripherals with DMA capability. The IP-Bus 3 can be  
accessed by the ARM CPU through IP-Bus 1 and SPBA.  
Quality of service controller (QoSC)—This provides both soft and dynamic arbitration/priority  
control. The QoSC works in conjunction with the critical display modules such as the eLCDIF and  
EPDC to provide dynamic priority control, based on real-time metrics.  
The i.MX50 makes use of dedicated hardware accelerators to achieve state-of-the-art multimedia  
performance. The use of hardware accelerators provides both high performance and low power  
consumption, while freeing up the CPU core for other tasks.  
The i.MX50 incorporates the following hardware accelerators:  
GPU2Dv1—2D Graphics accelerator, OpenVG 1.1, 200 Mpix/s performance  
ePXP—enhanced PiXel Processing Pipeline off loading key pixel processing operations required  
to support both LCD and EPD display applications  
The i.MX50 includes the following interfaces to external devices:  
NOTE  
Not all the interfaces are available simultaneously depending on I/O  
multiplexer configuration.  
Displays:  
— EPDC (i.MX508 Only)—Supporting direct-driver TFT backplanes beyond 2048 × 1536 at  
106 Hz refresh (or 4096 × 4096 at 20 Hz)  
— eLCDIF—Supporting beyond SXGA + (1400 × 1050) at 60 Hz resolutions with up to a 32-bit  
display interface  
— On the i.MX508, both displays can be active simultaneously. If both displays are active, the  
eLCDIF only provides a 16-bit interface due to pin muxing.  
Expansion cards:  
— Four SD/MMC card  
USB:  
— One High Speed (HS) USB 2.0 OTG-capable port with integrated HS USB PHY  
i.MX50 Applications Processors for Consumer Products, Rev. 2  
Freescale Semiconductor  
5

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