是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 | 针数: | 360 |
Reach Compliance Code: | not_compliant | ECCN代码: | 3A991.A.1 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.37 |
其他特性: | ALSO REQUIRES 1.8V OR 2.5V SUPPLY | 地址总线宽度: | 36 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 167 MHz | 外部数据总线宽度: | 64 |
格式: | FLOATING POINT | 集成缓存: | YES |
JESD-30 代码: | S-CBGA-B360 | JESD-609代码: | e0 |
长度: | 25 mm | 低功率模式: | YES |
湿度敏感等级: | 1 | 端子数量: | 360 |
封装主体材料: | CERAMIC, METAL-SEALED COFIRED | 封装代码: | BGA |
封装等效代码: | BGA360,19X19,50 | 封装形状: | SQUARE |
封装形式: | GRID ARRAY | 峰值回流温度(摄氏度): | 260 |
电源: | 1.3,1.8/2.5 V | 认证状态: | Not Qualified |
座面最大高度: | 3.24 mm | 速度: | 1333 MHz |
子类别: | Microprocessors | 最大供电电压: | 1.35 V |
最小供电电压: | 1.25 V | 标称供电电压: | 1.3 V |
表面贴装: | YES | 技术: | CMOS |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 25 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MC7447AHX1420LB | NXP | APOLO7PM,RV1.1,1.3V,105C |
获取价格 |
|
MC7447AHX600NB | NXP | RISC Microprocessor Hardware Specifications |
获取价格 |
|
MC7447AHX733NB | NXP | RISC Microprocessor Hardware Specifications |
获取价格 |
|
MC7447AHX867NB | NXP | RISC Microprocessor Hardware Specifications |
获取价格 |
|
MC7447ATHX1000NB | NXP | APOLO7PM,REV1.1,1.1V,-40C |
获取价格 |
|
MC7447ATHX1167NB | NXP | RISC Microprocessor Hardware Specifications |
获取价格 |