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MC7400 PDF预览

MC7400

更新时间: 2024-02-19 11:19:02
品牌 Logo 应用领域
安森美 - ONSEMI 比较器
页数 文件大小 规格书
12页 131K
描述
Single Supply Quad Comparators

MC7400 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:DIP
包装说明:DIP,针数:14
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.9系列:74
JESD-30 代码:R-PDIP-T14JESD-609代码:e0
逻辑集成电路类型:NAND GATE功能数量:4
输入次数:2端子数量:14
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED传播延迟(tpd):29 ns
认证状态:Not Qualified最大供电电压 (Vsup):5.25 V
最小供电电压 (Vsup):4.75 V标称供电电压 (Vsup):5 V
表面贴装:NO技术:TTL
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED

MC7400 数据手册

 浏览型号MC7400的Datasheet PDF文件第2页浏览型号MC7400的Datasheet PDF文件第3页浏览型号MC7400的Datasheet PDF文件第4页浏览型号MC7400的Datasheet PDF文件第5页浏览型号MC7400的Datasheet PDF文件第6页浏览型号MC7400的Datasheet PDF文件第7页 
LM339, LM239, LM2901,  
LM2901V, NCV2901,  
MC3302  
Single Supply Quad  
Comparators  
http://onsemi.com  
These comparators are designed for use in level detection, low−level  
sensing and memory applications in consumer, automotive, and  
industrial electronic applications.  
SOIC−14  
D SUFFIX  
CASE 751A  
14  
Features  
1
Single or Split Supply Operation  
Low Input Bias Current: 25 nA (Typ)  
Low Input Offset Current: 5.0 nA (Typ)  
Low Input Offset Voltage  
PDIP−14  
N, P SUFFIX  
CASE 646  
Input Common Mode Voltage Range to GND  
Low Output Saturation Voltage: 130 mV (Typ) @ 4.0 mA  
TTL and CMOS Compatible  
14  
1
ESD Clamps on the Inputs Increase Reliability without Affecting  
Device Operation  
NCV Prefix for Automotive and Other Applications Requiring Site  
and Control Changes  
TSSOP−14  
DTB SUFFIX  
CASE 948G  
14  
Pb−Free Packages are Available  
1
PIN CONNECTIONS  
1
2
14  
Output 2  
Output 1  
Output 3  
Output 4  
GND  
13  
12  
11  
3
V
CC  
4
5
− Input 1  
+ Input 1  
+ Input 4  
*
)
)
*
1
4
10 − Input 4  
− Input 2  
+ Input 2  
6
7
9
8
+ Input 3  
− Input 3  
*
)
)
*
2
3
(Top View)  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 6 of this data sheet.  
DEVICE MARKING INFORMATION  
See general marking information in the device marking  
section on page 8 of this data sheet.  
© Semiconductor Components Industries, LLC, 2007  
1
Publication Order Number:  
February, 2007 − Rev. 18  
LM339/D  

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