生命周期: | Obsolete | 零件包装代码: | TSSOP |
包装说明: | SOP, TSSOP16,.25 | 针数: | 16 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.84 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | R-PDSO-G16 | JESD-609代码: | e0 |
端子数量: | 16 | 最高工作温度: | 80 °C |
最低工作温度: | -20 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SOP | 封装等效代码: | TSSOP16,.25 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | NOT SPECIFIED | 电源: | 5 V |
认证状态: | Not Qualified | 子类别: | PLL or Frequency Synthesis Circuits |
最大供电电流 (Isup): | 90 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | BIPOLAR |
温度等级: | COMMERCIAL EXTENDED | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | GULL WING | 端子节距: | 0.635 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
Base Number Matches: | 1 |
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