Datasheet > MC33730EK

MC33730EK

更新时间： 2024-03-03 10:10:19

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
28页	1190K
描述
Power management IC, Switch Mode Power Supply with Multiple Linear Regulators, SOIC 32

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MC33730EK 数据手册

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS

MAXIMUM RATINGS

Table 3. Maximum Ratings

All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or

permanent damage to the device.

Ratings

Symbol

Value

Unit

Supply Voltage (VBAT)

V_BAT

-0.3 to +40

-18 to +40

-0.3 to +50

-0.3 to +12

-2.0 to +40

-1.0 to +26.5

2.0

Keep-Alive Supply Voltage (KA_VBAT)

Control Inputs (VIGN, P1, P2, P3), PFD Output

Bootstrap Voltage (BOOT, SR) referenced to ground

Bootstrap Voltage (BOOT, SR) referenced to SW

Charge Pump Output Voltage (CP)

KA_V_BAT

V_BOOT

V_BOOT- V_SW

V_CP

Switch Node Voltage SW

V_SW

Sensor Supplies (VREF1, VREF2)

V_REF

Sensor Supplies (VREF1, VREF2) Maximum Slew Rate

V_REFMAXSR

V_REG

V/µs

Regulator Voltages (V

, V

)

-0.3 to +7.0

-0.3 to +3.0

DDH DD3 DD3_B DDL DDL_B KAM

Open Drain Outputs (RSTH, RSTL, RST3, RSTKAM, IGN_ON)

Regon Input

V_DD

V_REGON

V_IN

Analog Inputs (VCOMP, INV, FREQ, HRT)

ESD Voltage⁽²⁾

V_ESD

Human Body Model - HBM (all pins except BOOT, VDDL, RSTL)

Human Body Model - HBM (Pins BOOT, VDDL, RSTL)

Machine Model - MM (all pins)

±2000

±1500

±200

Charge Device Model - CDM (all pins)

±750

Operational Package Temperature (Ambient Temperature)

Storage Temperature

T_{A_MAX}

T_STO

-40 to +125

-65 to +150

Note 4

°C

Peak Package Reflow Temperature During Reflow^{(3), (4)}

Maximum Junction Temperature

T_PPRT

°C

T_{J_MAX}

150

°C

Thermal Resistance, Junction to Ambient⁽⁵⁾

Thermal Resistance, Junction to Case⁽⁶⁾

Notes

°C/W

J-A

1.2

J-C

2. ESD testing is performed in accordance with the Human Body Model (HBM) (AEC-Q100-2), the Machine Model (MM) (AEC-Q100-003),

_ZAP= 0 Ω), and the Charge Device Model (CDM), Robotic (AEC-Q100-011).

3. Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may

cause malfunction or permanent damage to the device.

4. Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow

Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes

and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.

5. Thermal resistance measured in accordance with EIA/JESD51-2.

6. Theoretical thermal resistance from the die junction to the exposed pad.

33730

Analog Integrated Circuit Device Data

Freescale Semiconductor

1...3 4 567 8 9...28

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