MBRD5H100T4G
SWITCHMODE
Schottky Power Rectifier
Surface Mount Power Package
This series of Power Rectifiers employs the Schottky Barrier
principle in a large metal−to−silicon power diode. State−of−the−art
geometry features epitaxial construction with oxide passivation and
metal overlay contact. Ideally suited for use in low voltage, high
frequency switching power supplies, free wheeling diodes, and
polarity protection diodes.
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
5 AMPERES, 100 VOLTS
Features
• Guardring for Stress Protection
• Low Forward Voltage
• 175°C Operating Junction Temperature
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Short Heat Sink Tab Manufactured − Not Sheared!
• This is a Pb−Free Device
1
4
3
(Pin 1: No Connect)
Mechanical Characteristics:
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 0.4 grams (approximately)
MARKING
DIAGRAM
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
4
YWW
DPAK
CASE 369C
B
2
1
• Device Meets MSL1 Requirements
5100G
3
• ESD Ratings: Machine Model, C (>400 V)
Human Body Model, 3B (>8000 V)
Y
WW
B5100
G
= Year
= Work Week
= Device Code
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
= Pb−Free Package
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
100
V
RRM
RWM
V
R
Average Rectified Forward Current
I
5
A
A
F(AV)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
(Rated V ) T = 171°C
R
C
Peak Repetitive Forward Current
(Rated V , Square Wave, 20 kHz)
I
10
FRM
R
T
= 171°C
C
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions
halfwave, single phase, 60 Hz)
I
105
A
FSM
Operating Junction and Storage
Temperature Range (Note 1)
T , T
−65 to +175
°C
J
stg
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dP /dT < 1/R .
q
JA
D
J
©
Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
July, 2010 − Rev. 3
MBRD5H100/D