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MBRB8100H PDF预览

MBRB8100H

更新时间: 2024-10-03 14:52:59
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
3页 1290K
描述
Tube: 50pcs/Tube, 5K/Ctn,Tape : 800pcs/Reel , 8K/Ctn.;

MBRB8100H 数据手册

 浏览型号MBRB8100H的Datasheet PDF文件第2页浏览型号MBRB8100H的Datasheet PDF文件第3页 
MBRB8100H  
Features  
Halogen Free. "Green" Device (Note 1)  
Lead Free Finish/RoHS Compliant(Note 2) ("P" Suffix Designates  
Compliant. See Ordering Information)  
8 Amp  
High Current Capability, High Efficiency  
High Junction Temperature Capability  
Epoxy Meets UL 94 V-0 Flammability Rating  
Moisture Sensitivity Level 1  
Schottky Barrier  
Rectifier  
100 Volts  
Maximum Ratings  
Operating Junction Temperature Range: -55⁰C to +175⁰C  
Storage Temperature Range: -55⁰C to +175⁰C  
Typical Thermal Resistance: 2 ⁰C/W Junction to Case  
D2-PAK  
Maximum  
Maximum  
Recurrent  
Peak Reverse  
Voltage  
Maximum  
RMS  
DC  
Blocking  
Voltage  
MCC  
Part Number  
Device  
Marking  
S
V
A
Voltage  
1
2
3
MBRB8100H  
MBRB8100H  
100V  
70V  
100V  
G
4
B
Electrical Characteristics @ 25°C Unless Otherwise Specified  
D
H
C
Average Rectified  
IF(AV)  
8A  
TC=160C  
Forward Current  
w
E
J
K
Peak Forward Surge  
Current  
IFSM  
300A  
8.3ms,Half Sine Wave  
DIMENSIONS  
MM  
MIN MAX MIN MAX  
INCHES  
DIM  
NOTE  
TYP.  
IF=8A;  
IF=8A;  
0.70V(typ.)  
0.75V(max)  
TJ=25C  
TJ=25C  
A
B
C
D
E
G
H
J
K
S
V
W
0.331 0.370 8.40 9.40  
0.378 0.417 9.60 10.60  
0.165 0.189 4.20 4.80  
0.027 0.037 0.68 0.94  
0.045 0.055 1.14 1.40  
Instantaneous  
Forward Voltage  
VF  
0.65V(max)  
IF=8A;  
TJ=125C  
Maximum Reverse  
Current at Rated  
DC Blocking  
0.10  
2.54  
0.01mA  
10mA  
TJ=25C  
0.096 0.134 2.43 3.40  
0.011 0.025 0.28 0.64  
0.071 0.131 1.80 3.32  
0.575 0.625 14.60 15.87  
0.042 0.058 1.07 1.47  
0.000 0.010 0.00 0.25  
IR  
TJ=125⁰C  
Voltage  
Note:  
1. Halogen free "Green” products are defined as those which contain <900ppm bromine,  
<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.  
2. High temperature solder exemption applied, see EU directive annex 7a.  
Suggested Solder Pad Layout  
Unit:mm  
10.26  
1.78  
3.50  
10.66  
5.08  
Internal Structure  
PIN 2,4  
8.38  
PIN 3  
Rev.3-2-08202023  
1/3  
MCCSEMI.COM  

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