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MB8508S064CZ-102LDG PDF预览

MB8508S064CZ-102LDG

更新时间: 2024-02-26 10:15:51
品牌 Logo 应用领域
富士通 - FUJITSU 动态存储器内存集成电路
页数 文件大小 规格书
20页 441K
描述
Synchronous DRAM Module, 8MX64, 6ns, CMOS, PLASTIC, DIMM-168

MB8508S064CZ-102LDG 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.28风险等级:5.84
访问模式:FOUR BANK PAGE BURST最长访问时间:6 ns
JESD-30 代码:R-XDMA-N168内存密度:536870912 bit
内存集成电路类型:SYNCHRONOUS DRAM MODULE内存宽度:64
功能数量:1端口数量:1
端子数量:168字数:8388608 words
字数代码:8000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:8MX64封装主体材料:UNSPECIFIED
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
认证状态:Not Qualified最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子位置:DUALBase Number Matches:1

MB8508S064CZ-102LDG 数据手册

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FUJITSU SEMICONDUCTOR  
DATA SHEET  
DS05-11139-1E  
MEMORY  
Un-buffered  
8 M × 64 BIT  
SYNCHRONOUS DYNAMIC RAM DIMM  
MB8508S064CZ-102/-103/-102L/-103L  
168-pin, 4 Clock, 1-bank, based on 8 M × 8 Bit SDRAMs with SPD  
DESCRIPTION  
TheFujitsuMB8508S064CZisafullydecoded, CMOSSynchronousDynamicRandomAccessMemory(SDRAM)  
Module consisting of eight MB81F64842C devices which organized as four banks of 8 M × 8 bits and a 2K-bit  
serial EEPROM on a 168-pin glass-epoxy substrate.  
The MB8508S064CZ features a fully synchronous operation referenced to a positive edge clock whereby all  
operations are synchronized at a clock input which enables high performance and simple user interface  
coexistence.  
The MB8508S064CZ is optimized for those applications requiring high speed, high performance and large  
memory storage, and high density memory organizations.  
This module is ideally suited for workstations, PCs, laser printers, and other applications where a simple interface  
is needed.  
PRODUCT LINE & FEATURES  
Parameter  
MB8508S064CZ-102/-102L  
2-2-2 clk min.  
MB8508S064CZ-103/-103L  
3-2-2 clk min.  
CL-tRCD-tRP  
Clock Frequency  
100 MHz max.  
100 MHz max.  
Burst Mode Cycle Time  
Output Valid from Clock  
10 ns min.  
10 ns min.  
6 ns max. (CL = 2)  
5472 mW max.  
6 ns max. (CL = 3)  
5472 mW max.  
Two Banks Active  
Self Refresh Mode  
Power Dissipation  
28.8 mW max. (Std. power)  
14.4 mW max. (Low power)  
28.8 mW max. (Std. power)  
14.4 mW max. (Low power)  
• Un-buffered 168-pin DIMM Socket Type  
(Lead pitch: 1.27 mm)  
• Conformed to JEDEC Standard (4 CLK)  
• Organization: 8,388,608 words × 64 bits  
• Memory: MB81F64842C (8 M × 8, 4-bank) × 8 pcs  
• 3.3 V ±0.3 V Supply Voltage  
• 4096 Refresh Cycle every 65.6 ms  
• Auto and Self Refresh  
• CKE Power Down Mode  
• DQM Byte Masking (Read/Write)  
• Serial Presence Detect (SPD) with Serial EEPROM:  
Intel SPD spec Rev 1.2A Format  
• All input/output LVTTL compatible  
• Conformed to Intel PC/100 spec  
• Module size:  
1.375” (height) × 5.25” (length) × 0.157” (thickness)  

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