Datasheet > MB1M

MB1M

更新时间： 2023-12-06 20:00:25

品牌	Logo	应用领域
鲁光 - LGE		普通整流桥
页数	文件大小	规格书
2页	1160K
描述
普通整流桥

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MB1M 数据手册

MB2M-MB10M

SILICON BRIDGE RECTIFIERS

MBM

Dim

Min

Max

4.80

3.80

2.65

0.35

5.20

0.80

6.30

2.70

5.90

4.40

FEATURES

3.40

2.35

Glass passivated chip junctions

0.15

4.60

High surge overload rating: 35A peak

0.50

5.70

Saves space on printed circuit boards

2.30

5.40

Plastic material has U/L flammability classification94V-O

All Dimensions in mm

This series is UL recognized under Component Index, file number E239431

High temperature soldering guaranteed: 260°C/10 seconds at 5 lbs. (2.3kg) tension

MECHANICAL DATA

Case: Molded plastic body over passivated junctions

Terminals: Plated leads solderable per MIL-STD-750, Method 2026

Maximum Ratings ^{(@TA = 25°C unless otherwise specified)}

Characteristic

Symbol

MB2M

MB4M

MB6M

MB8M

MB10M

UNITS

Peak Repetitive Reverse Voltage

RMS Reverse Voltage

V_RRM

V_RMS

V_DC

200

140

200

400

280

400

600

420

600

0.5¹⁾

0.8²⁾

800

560

800

1000

700

DC Blocking Voltage

1000

Maximum average forward Output current

I_F(AV)

@T_A=25℃

Peak forward surge current 8.3ms single half-sine-

I_FSM

wave superimposed on rated load

Current squared time t < 8.3ms , Ta = 25℃

I²t

5.1

A²s

Thermal Characteristics

Characteristic

Symbol

MB2M

MB4M

MB6M

MB8M

MB10M

UNITS

Typical junction capacitance per leg (NOTE 3)

C_J

p F

Typical thermal resistance per leg

(NOTE 1)

(NOTE 2)

R _ΘJA

R _{θ JL}

T_J

℃/W

Operating junction temperature range

Storage temperature range

- 55 ---- + 150

℃

T_STG

Electrical Characteristics ^{(@TA = 25°C unless otherwise specified)}

Characteristic

Symbol

MB2M

MB4M

MB6M

MB8M

MB10M

UNITS

Maximum instantaneous forward voltage at 0.4 A

V_F

1.0

Maximum reverse current @T_A=25℃

5.0

I_R

μ A

at rated DC blocking voltage @T_A=125℃

100

NOTES: (1) On glass epoxy P.C.B. mounted on 0.05 x 0.05" (1.3 x 1.3mm) pads

(2) On aluminum substrate P.C.B. with an area of 0.8" x 0.8" (20 x 20mm) mounted on 0.05 x 0.05" (1.3 x 1.3mm) solder pad

(3) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts

http://www.lgesemi.com

mail:lge@lgesemi.com

Revision:20170701-P1

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