是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | DFN |
包装说明: | HVSON, SOLCC14,.12,16 | 针数: | 14 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.15 |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | S-XDSO-N14 | JESD-609代码: | e3 |
长度: | 3 mm | 湿度敏感等级: | 1 |
信道数量: | 1 | 功能数量: | 1 |
端子数量: | 14 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVSON | 封装等效代码: | SOLCC14,.12,16 |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 5 V |
认证状态: | Not Qualified | 座面最大高度: | 0.8 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 3 mA |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 4.25 V |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | BICMOS | 温度等级: | INDUSTRIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | NO LEAD |
端子节距: | 0.95 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 3 mm |
Base Number Matches: | 1 |
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