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MAX7318AUG-T PDF预览

MAX7318AUG-T

更新时间: 2024-01-26 19:10:40
品牌 Logo 应用领域
美信 - MAXIM 信息通信管理光电二极管外围集成电路
页数 文件大小 规格书
16页 306K
描述
Parallel I/O Port, 16-Bit, 16 I/O, BICMOS, PDSO24, 4.40 MM, MO-153AD, TSSOP-24

MAX7318AUG-T 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:TSSOP, TSSOP24,.25针数:24
Reach Compliance Code:not_compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.34
JESD-30 代码:R-PDSO-G24JESD-609代码:e0
长度:7.8 mm湿度敏感等级:1
位数:16I/O 线路数量:16
端口数量:1端子数量:24
最高工作温度:125 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP24,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH峰值回流温度(摄氏度):245
电源:2/5.5 V认证状态:Not Qualified
座面最大高度:1.1 mm子类别:Parallel IO Port
最大供电电压:5.5 V最小供电电压:2 V
标称供电电压:3.3 V表面贴装:YES
技术:BICMOS温度等级:AUTOMOTIVE
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:4.4 mm
uPs/uCs/外围集成电路类型:PARALLEL IO PORT, GENERAL PURPOSEBase Number Matches:1

MAX7318AUG-T 数据手册

 浏览型号MAX7318AUG-T的Datasheet PDF文件第1页浏览型号MAX7318AUG-T的Datasheet PDF文件第2页浏览型号MAX7318AUG-T的Datasheet PDF文件第4页浏览型号MAX7318AUG-T的Datasheet PDF文件第5页浏览型号MAX7318AUG-T的Datasheet PDF文件第6页浏览型号MAX7318AUG-T的Datasheet PDF文件第7页 
2-Wire-Interfaced, 16-Bit, I/O Port Expander  
with Interrupt and Hot-Insertion Protection  
DC ELECTRICAL CHARACTERISTICS (continued)  
(V+ = 2V to 5.5V, T = -40°C to +125°C, unless otherwise noted. Typical values are at V+ = 3.3V, T = +25°C.) (Note 1)  
A
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
-1  
TYP  
MAX  
UNITS  
µA  
Leakage Current  
+1  
Input Capacitance  
INT  
4
pF  
Low-Level Output Current  
I
V
= 0.4V  
OL  
6
mA  
OL  
AC ELECTRICAL CHARACTERISTICS  
(V+ = 2V to 5.5V, T = -40°C to +125°C, unless otherwise noted.) (Note 1)  
A
PARAMETER  
SYMBOL  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
SCL Clock Frequency  
f
400  
kHz  
SCL  
Bus Free Time Between STOP  
and START Conditions  
t
Figure 2  
Figure 2  
1.3  
0.6  
µs  
µs  
µs  
BUF  
Hold Time (Repeated) START  
Condition  
t
HD,STA  
Repeated START Condition  
Setup Time  
t
Figure 2  
Figure 2  
0.6  
0.6  
SU,STA  
STOP Condition Setup Time  
Data Hold Time  
t
µs  
µs  
ns  
µs  
µs  
SU,STO  
t
Figure 2 (Note 2)  
Figure 2  
0.9  
HD,DAT  
Data Setup Time  
t
100  
1.3  
0.7  
SU,DAT  
SCL Low Period  
t
Figure 2  
LOW  
SCL High Period  
t
Figure 2  
HIGH  
V+ < 3.3V  
500  
250  
SDA Fall Time  
t
Figure 2 (Notes 3, 4)  
(Note 5)  
ns  
ns  
F
V+ 3.3V  
Pulse Width of Spike Suppressed  
PORT TIMING  
t
t
50  
SP  
PV  
Output Data Valid  
Figure 7  
3
µs  
µs  
µs  
Input Data Setup Time  
Input Data Hold Time  
INTERRUPT TIMING  
Interrupt Valid  
27  
0
t
Figure 9  
Figure 9  
30.5  
2
µs  
µs  
IV  
Interrupt Reset  
t
IR  
Note 1: All parameters are 100% production tested at T = +25°C. Specifications over temperature are guaranteed by design.  
A
Note 2: A master device must internally provide a hold time of at least 300ns for the SDA signal (referred to the V of the SCL  
IL  
signal) to bridge the undefined region SCL’s falling edge.  
Note 3: C = total capacitance of one bus line in pF.  
B
Note 4: The maximum t for the SDA and SCL bus lines is specified at 300ns. The maximum fall time for the SDA output stage t is  
F
F
specified at 250ns. This allows series protection resistors to be connected between the SDA and SCL pins and the  
SDA/SCL bus lines without exceeding the maximum specified t .  
F
Note 5: Input filters on the SDA and SCL inputs suppress noise spikes less than 50ns.  
_______________________________________________________________________________________  
3

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