Datasheet > MAX3863EVKIT

MAX3863EVKIT

更新时间： 2024-01-04 14:37:56

品牌	Logo	应用领域
美信 - MAXIM		/
页数	文件大小	规格书
11页	537K
描述
Evaluation Kit for the MAX3863

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技术参数
数据手册

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MAX3863EVKIT 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Obsolete	零件包装代码：	QFN
包装说明：	HVQCCN, LCC32,.2SQ,20	针数：	32
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8542.39.00.01	风险等级：	5.81
接口集成电路类型：	INTERFACE CIRCUIT	JESD-30 代码：	S-XQCC-N32
JESD-609代码：	e3	长度：	5 mm
湿度敏感等级：	1	功能数量：	1
端子数量：	32	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装主体材料：	UNSPECIFIED
封装代码：	HVQCCN	封装等效代码：	LCC32,.2SQ,20
封装形状：	SQUARE	封装形式：	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
峰值回流温度（摄氏度）：	260	电源：	3.3 V
认证状态：	Not Qualified	座面最大高度：	0.8 mm
子类别：	Display Drivers	最大供电电压：	3.6 V
最小供电电压：	3.15 V	标称供电电压：	3.3 V
表面贴装：	YES	技术：	BIPOLAR
温度等级：	INDUSTRIAL	端子面层：	Tin (Sn)
端子形式：	NO LEAD	端子节距：	0.5 mm
端子位置：	QUAD	处于峰值回流温度下的最长时间：	NOT SPECIFIED
宽度：	5 mm	Base Number Matches：	1

MAX3863EVKIT 数据手册

MAX3863 Evaluation Kit

Note: When performing the following resistance

checks, manually set the ohmmeter to a high

range to avoid forward biasing the on-chip ESD

protection diodes.

Optical Evaluation

1) If the data is latched, place the shunt for JU2 to

ground RTEN to enable the clock input. Otherwise,

set JU2 so that RTEN is connected to V

2) To enable the part, set shunt JU1 so that EN is

6) Adjust R16, the MODSET potentiometer, for maxi-

mum resistance between test point 3 and ground.

grounded.

3) To disable the APC loop, install JU15. This allows

direct control of the bias current.

7) Adjust R14, the BIASMAX potentiometer, to give a

bias current larger than the threshold current speci-

fied for the laser diode. A combined resistance

value of 5.9kΩ gives approximately 40mA of bias

current:

4) To eliminate interaction between the bias current

and the modulation current, remove JU3.

5) The EV kit is designed to allow connection of various

laser/monitor diode pin configurations. Connect a

TO-header style laser with monitor diode (Figure 1)

as follows:

1.2V

= 200 x

BIAS

•

Keeping the module leads as short as possible,

connect the laser diode cathode to the center

pad on the component side of the circuit board.

Connect the anode to one of the two remaining

VCC pads, such that the monitor diodes leads

can solder to the bottom of the circuit board.

8) Apply a differential input signal of 250mV

to the

P-P

DATA inputs, and to the CLK inputs if retiming is

enabled.

INPUT VOLTAGE RANGE

•

The monitor photodiode pads are arranged in a

series of five pads on the bottom (solder side) of

the PC board. Next to the five photodiode pads

are three solder bridge pad pairs. The MD pin

can be connected to any three of the five pads

through a solder bridge. The remaining two of

the five pads are connected to VCC. The VCC

pads are placed between the pads going to the

solder bridge pads. Solder the photodiode to

the nearest two of the three pads going to the

solder bridge pads (Figure 1).

Peak-to-peak differential

200mV to 1600mV

voltage

Instantaneous voltage

- 1.5V to V + 0.5V

CC CC

9) Attach the laser diode fiber connector to an opti-

cal/electrical converter.

10) Power up the board with a +3.3V supply.

11) Adjust R16 until the desired optical amplitude is

achieved. Optical amplitude can be observed on an

oscilloscope connected to an optical/electrical con-

verter. If the signal clips, the bias current might

need to be increased. Refer to the Design

Procedure section of the MAX3863 data sheet to set

the modulation compensation factor.

•

Connect the anode of the photo diode to the MD

pin by adding a solder bridge to one of the three

solder bridge positions. Connect the photodiode

cathode to VCC by bridging the cathode pad to

the adjacent VCC pad.

_______________________________________________________________________________________

1 2 345 6 7...11

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