是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | TSSOP |
包装说明: | HTSSOP, TSSOP10,.19,20 | 针数: | 10 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | Factory Lead Time: | 1 week |
风险等级: | 5.16 | Is Samacsys: | N |
JESD-30 代码: | S-PDSO-G10 | JESD-609代码: | e3 |
长度: | 3 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 10 |
最高工作温度: | 70 °C | 最低工作温度: | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HTSSOP |
封装等效代码: | TSSOP10,.19,20 | 封装形状: | SQUARE |
封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | 峰值回流温度(摄氏度): | 260 |
电源: | 3.3/5 V | 认证状态: | Not Qualified |
座面最大高度: | 1.1 mm | 子类别: | ATM/SONET/SDH ICs |
最大压摆率: | 0.062 mA | 标称供电电压: | 3.3 V |
表面贴装: | YES | 技术: | BIPOLAR |
电信集成电路类型: | TELECOM CIRCUIT | 温度等级: | COMMERCIAL |
端子面层: | Matte Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 3 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MAX3268CUB-T | MAXIM |
功能相似 |
Telecom Circuit, 1-Func, Bipolar, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | |
MAX3268CUB | MAXIM |
功能相似 |
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MAX3268CUB-T | MAXIM |
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