是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Obsolete | 零件包装代码: | TSSOP |
包装说明: | EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | 针数: | 10 |
Reach Compliance Code: | not_compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.33.00.01 | Factory Lead Time: | 1 week |
Is Samacsys: | N | JESD-30 代码: | S-PDSO-G10 |
JESD-609代码: | e0 | 长度: | 3 mm |
湿度敏感等级: | 1 | 功能数量: | 1 |
端子数量: | 10 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | HTSSOP | 封装等效代码: | TSSOP10,.19,20 |
封装形状: | SQUARE | 封装形式: | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度): | 240 | 电源: | 3.3/5 V |
认证状态: | Not Qualified | 座面最大高度: | 1.1 mm |
子类别: | ATM/SONET/SDH ICs | 最大压摆率: | 0.062 mA |
标称供电电压: | 3.3 V | 表面贴装: | YES |
技术: | BIPOLAR | 电信集成电路类型: | TELECOM CIRCUIT |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn85Pb15) |
端子形式: | GULL WING | 端子节距: | 0.5 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | 20 |
宽度: | 3 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
MAX3268CUB-T | MAXIM |
功能相似 |
Telecom Circuit, 1-Func, Bipolar, PDSO10, EXPOSED PAD, MO-187C-BA, MICRO MAX, PACKAGE-10 | |
MAX3268CUB+T | MAXIM |
功能相似 |
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MAX3268CUB+ | MAXIM |
功能相似 |
暂无描述 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MAX3268CUB+ | MAXIM |
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暂无描述 | |
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MAX3268CUB-T | MAXIM |
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3.0V to 5.5V.1.25Gbps/2.5Gbps Limiting Amplifiers | |
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3.0V to 5.5V, 1.25Gbps/2.5Gbps Limiting Amplifiers | |
MAX3269CUB+T | MAXIM |
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Telecom Circuit, 1-Func, Bipolar, PDSO10, LEAD FREE, MO-187C-BA, UMAX-10 | |
MAX3269EVKIT | MAXIM |
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