是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | SSOP, SSOP16,.01 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 2.12 | 模拟集成电路 - 其他类型: | ANALOG CIRCUIT |
JESD-30 代码: | R-PDSO-G16 | 长度: | 8.66 mm |
信道数量: | 4 | 功能数量: | 1 |
端子数量: | 16 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | SSOP | 封装等效代码: | SSOP16,.01 |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE, SHRINK PITCH |
峰值回流温度(摄氏度): | NOT SPECIFIED | 座面最大高度: | 1.75 mm |
最大供电电压 (Vsup): | 5.5 V | 最小供电电压 (Vsup): | 1.71 V |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | BICMOS | 温度等级: | AUTOMOTIVE |
端子形式: | GULL WING | 端子节距: | 0.635 mm |
端子位置: | DUAL | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3.89 mm | Base Number Matches: | 1 |
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