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M965G0225MP0-C50 PDF预览

M965G0225MP0-C50

更新时间: 2024-01-29 23:44:01
品牌 Logo 应用领域
三星 - SAMSUNG 时钟动态存储器内存集成电路
页数 文件大小 规格书
14页 362K
描述
Synchronous Graphics RAM Module, 2MX64, 4.5ns, CMOS, SODIMM-144

M965G0225MP0-C50 技术参数

生命周期:Obsolete零件包装代码:MODULE
包装说明:DIMM, DIMM144,32针数:144
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.84
访问模式:DUAL BANK PAGE BURST最长访问时间:4.5 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):200 MHz
I/O 类型:COMMONJESD-30 代码:R-XDMA-N144
内存密度:134217728 bit内存集成电路类型:SYNCHRONOUS GRAPHICS RAM MODULE
内存宽度:64功能数量:1
端口数量:1端子数量:144
字数:2097152 words字数代码:2000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:2MX64
输出特性:3-STATE封装主体材料:UNSPECIFIED
封装代码:DIMM封装等效代码:DIMM144,32
封装形状:RECTANGULAR封装形式:MICROELECTRONIC ASSEMBLY
电源:3.3 V认证状态:Not Qualified
刷新周期:2048自我刷新:YES
最大待机电流:0.008 A子类别:DRAMs
最大压摆率:0.8 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:CMOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:0.8 mm端子位置:DUAL
Base Number Matches:1

M965G0225MP0-C50 数据手册

 浏览型号M965G0225MP0-C50的Datasheet PDF文件第1页浏览型号M965G0225MP0-C50的Datasheet PDF文件第2页浏览型号M965G0225MP0-C50的Datasheet PDF文件第3页浏览型号M965G0225MP0-C50的Datasheet PDF文件第5页浏览型号M965G0225MP0-C50的Datasheet PDF文件第6页浏览型号M965G0225MP0-C50的Datasheet PDF文件第7页 
SGRAM MODULE  
M965G0225MP(Q)0 / M966G0225MP(Q)0  
ABSOLUTE MAXIMUM RATINGS (Voltages referenced to VSS)  
Parameter  
Voltage on any pin relative to Vss  
Voltage on VDD supply relative to Vss  
Storage temperature  
Symbol  
VIN, VOUT  
VDD  
Value  
-1.0 ~ 4.6  
-1.0 ~ 4.6  
-55 ~ +150  
4
Unit  
V
V
TSTG  
°C  
W
Power dissipation  
PD  
Short circuit current  
IOS  
50  
mA  
Note :  
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded.  
Functional operation should be restricted to recommended operating condition.  
Exposure to higher than recommended voltage for extended periods of time could affect device reliability.  
DC OPERATING CONDITIONS  
Recommended operating conditions (Voltage referenced to VSS = 0V)  
Parameter  
Supply voltage  
Symbol  
VDD  
VIH  
Min  
3.0  
2.0  
-0.3  
2.4  
-
Typ  
Max  
3.6  
Unit  
V
Note  
3.3  
Note 4  
Input high voltage  
3.0  
VDD+0.3  
0.8  
V
Input low voltage  
VIL  
0
-
V
Note 1  
IOH = -2mA  
IOL = 2mA  
Note 2  
Output high voltage  
Output low voltage  
Input leakage current  
Output leakage current  
Output loading conditon  
VOH  
VOL  
ILI  
-
V
-
0.4  
V
-40  
-20  
-
40  
uA  
uA  
ILO  
-
20  
Note 3  
See Figure 1  
Note :  
1. VIL(min.) = -1.5V AC (pulse width £ 5ns)  
2. Any input 0V £ VIN £ VDD + 0.3V, all other pins are not under test = 0V.  
3. Dout is disabled, 0V £ VOUT £ VDD  
4. The VDD condition of M965(6)G0225MP(Q)0-C50/60 is 3.135V~3.6V.  
CAPACITANCE (VCC = 3.3V, TA = 25°C, f = 1MHz)  
Parameter  
Symbol  
Min  
Max  
Unit  
Input capacitance (A0 ~ A10, BA)  
CIN1  
CIN2  
CIN3  
CIN4  
CIN5  
COUT  
-
-
-
-
-
-
26  
26  
18  
18  
18  
20  
pF  
pF  
pF  
pF  
pF  
pF  
Input capacitance (RAS, CAS, WE, CKE, DSF)  
Input capacitance (CLK0,CLK1)  
Input capacitance (CS0,CS1)  
Input capacitance (DQM0 ~ DQM7)  
Data input/output capacitance (DQ0 ~ DQ63)  

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