Datasheet > M68HC16ZEC20

M68HC16ZEC20

更新时间： 2023-12-18 00:00:00

品牌	Logo	应用领域
恩智浦 - NXP		/
页数	文件大小	规格书
28页	652K
描述
20.97 MHz Electrical Characteristics

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M68HC16ZEC20 数据手册

Freescale Semiconductor, Inc.

Table A–2 Typical Ratings

Num

Rating

Symbol

Value

Unit

Supply Voltage

Operating Temperature

Supply Current

5.0

°C

RUN

µA

113

125

3.75

LPSTOP, VCO off

LPSTOP, External clock, max f

sys

Clock Synthesizer Operating Voltage

Supply Current

5.0

DDSYN

VCO on, maximum f

1.0

5.0

100

µA

sys

External Clock, maximum f

sys

DDSYN

LPSTOP, VCO off

µA

powered down

RAM Standby Current

Normal RAM operation

Standby operation

7.0

µA

Power Dissipation

570

Table A–3 Thermal Characteristics

Num

Characteristic

Symbol

Value

Unit

Thermal Resistance

Plastic 132-Pin Surface Mount

Plastic 144-pin Surface Mount

°C/W

NOTES:

1. The average chip-junction temperature (T ) in C can be obtained from (1):

T_J= T_A+ (P_DΘ_JA

)

where:

T = Ambient Temperature, °C

= Package Thermal Resistance, Junction-to-Ambient, °C/W

P = P

+ P

I/O

INT

= I × V , Watts — Chip Internal Power

= Power Dissipation on Input and Output Pins — User Determined

INT DD

I/O

For most applications P < P

and can be neglected. An approximate relationship between

I/O

INT

and T (if P is neglected) is (2):

I/O

P_D= K + (T_J+ 273°C)

Solving equations (1) and (2) for K gives (3):

K = P + (T_A+ 273°C) + Θ_JA× P_D

Where K is a constant pertaining to the particular part. K can be determined from equation (3) by

measuring P (at equilibrium) for a known T . Using this value of K, the values of P and T

can be obtained by solving equations (1) and (2) iteratively for any value of T .

M68HC16ZEC20/D

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