是否Rohs认证: | 不符合 | 生命周期: | Transferred |
零件包装代码: | QFN | 包装说明: | HVQCCN, LCC38,.2X.28,20 |
针数: | 38 | Reach Compliance Code: | not_compliant |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.16 | Is Samacsys: | N |
其他特性: | ALSO REQUIRES A 3.3V, 5V, -12V SUPPLY | 可调阈值: | YES |
模拟集成电路 - 其他类型: | POWER SUPPLY MANAGEMENT CIRCUIT | JESD-30 代码: | R-PQCC-N38 |
JESD-609代码: | e0 | 长度: | 7 mm |
湿度敏感等级: | 1 | 信道数量: | 4 |
功能数量: | 1 | 端子数量: | 38 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | HVQCCN |
封装等效代码: | LCC38,.2X.28,20 | 封装形状: | RECTANGULAR |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | 235 |
电源: | 3.3,5,+-12 V | 认证状态: | Not Qualified |
座面最大高度: | 0.8 mm | 子类别: | Power Management Circuits |
最大供电电流 (Isup): | 5 mA | 标称供电电压 (Vsup): | 12 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | 20 |
宽度: | 5 mm | Base Number Matches: | 1 |
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