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LNK563G PDF预览

LNK563G

更新时间: 2024-02-17 16:06:01
品牌 Logo 应用领域
帕沃英蒂格盛 - POWERINT 变压器开关
页数 文件大小 规格书
16页 752K
描述
Energy Effi cient Off-Line Switcher IC for Linear Transformer Replacement

LNK563G 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:DIP
包装说明:DIP,针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:14 weeks
风险等级:1.68其他特性:REQUIRES AN AC SUPPLY OF 85 TO 265 V
模拟集成电路 - 其他类型:SWITCHING REGULATOR控制技术:PULSE WIDTH MODULATION
JESD-30 代码:R-PDIP-T7JESD-609代码:e3
长度:9.575 mm功能数量:1
端子数量:7最高工作温度:125 °C
最低工作温度:-40 °C最大输出电流:0.2 A
封装主体材料:PLASTIC/EPOXY封装代码:DIP
封装形状:RECTANGULAR封装形式:IN-LINE
峰值回流温度(摄氏度):NOT SPECIFIED认证状态:Not Qualified
表面贴装:NO切换器配置:SINGLE
最大切换频率:89 kHz温度等级:AUTOMOTIVE
端子面层:Matte Tin (Sn)端子形式:THROUGH-HOLE
端子节距:2.54 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:7.62 mm
Base Number Matches:1

LNK563G 数据手册

 浏览型号LNK563G的Datasheet PDF文件第10页浏览型号LNK563G的Datasheet PDF文件第11页浏览型号LNK563G的Datasheet PDF文件第12页浏览型号LNK563G的Datasheet PDF文件第13页浏览型号LNK563G的Datasheet PDF文件第15页浏览型号LNK563G的Datasheet PDF文件第16页 
LNK562-564  
DIP-8B  
D S .004 (.10)  
Notes:  
.137 (3.48)  
1. Package dimensions conform to JEDEC specification  
MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP)  
package with .300 inch row spacing.  
MINIMUM  
-E-  
2. Controlling dimensions are inches. Millimeter sizes are  
shown in parentheses.  
3. Dimensions shown do not include mold flash or other  
protrusions. Mold flash or protrusions shall not exceed  
.006 (.15) on any side.  
.240 (6.10)  
.260 (6.60)  
4. Pin locations start with Pin 1, and continue counter-clock-  
wise to Pin 8 when viewed from the top. The notch and/or  
dimple are aids in locating Pin 1. Pin 6 is omitted.  
5. Minimum metal to metal spacing at the package body for  
the omitted lead location is .137 inch (3.48 mm).  
6. Lead width measured at package body.  
Pin 1  
-D-  
.367 (9.32)  
.387 (9.83)  
7. Lead spacing measured with the leads constrained to be  
perpendicular to plane T.  
.057 (1.45)  
.068 (1.73)  
(NOTE 6)  
.125 (3.18)  
.145 (3.68)  
.015 (.38)  
MINIMUM  
-T-  
SEATING  
PLANE  
.008 (.20)  
.015 (.38)  
.120 (3.05)  
.140 (3.56)  
.300 (7.62) BSC  
.100 (2.54) BSC  
.048 (1.22)  
(NOTE 7)  
.053 (1.35)  
T E D S .010 (.25) M  
P08B  
.300 (7.62)  
.390 (9.91)  
.014 (.36)  
.022 (.56)  
PI-2551-121504  
SMD-8B  
D S .004 (.10)  
Notes:  
.137 (3.48)  
1. Controlling dimensions are  
inches. Millimeter sizes are  
shown in parentheses.  
MINIMUM  
-E-  
2. Dimensions shown do not  
include mold flash or other  
protrusions. Mold flash or  
protrusions shall not exceed  
.006 (.15) on any side.  
3. Pin locations start with Pin 1,  
and continue counter-clock-  
wise to Pin 8 when viewed  
from the top. Pin 6 is omitted.  
4. Minimum metal to metal  
spacing at the package body  
for the omitted lead location  
is .137 inch (3.48 mm).  
.372 (9.45)  
.388 (9.86)  
.240 (6.10)  
.260 (6.60)  
.420  
.010 (.25)  
E S  
.046 .060 .060 .046  
.080  
Pin 1  
Pin 1  
-D-  
.086  
.186  
.100 (2.54) (BSC)  
5. Lead width measured at  
package body.  
6. D and E are referenced  
datums on the package  
body.  
.286  
.367 (9.32)  
.387 (9.83)  
Solder Pad Dimensions  
.057 (1.45)  
.068 (1.73)  
(NOTE 5)  
.125 (3.18)  
.145 (3.68)  
.004 (.10)  
.032 (.81)  
.037 (.94)  
.048 (1.22)  
.053 (1.35)  
°
°
.009 (.23)  
0 - 8  
.036 (0.91)  
.004 (.10)  
.044 (1.12)  
.012 (.30)  
G08B  
PI-2546-121504  
F
10/05  
14  

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